SPIE Photomask technology + EUV Lithography 2026

Imec will be participating in SPIE Photomask Technology + Extreme Ultraviolet Lithography, the premier international conference for the photomask and EUV lithography community. The event brings together experts to discuss the latest advances in photomasks, patterning, metrology, materials, inspection and repair, mask manufacturing, EUV lithography, and emerging technologies. 

Join us to learn more on our latest breakthroughs and how to work with imec:  

PRESENTATIONS

• PLENARY
  • September 8 • 8:40 AM
    Luc Van den hove, Chairman of imec
• PAPERS
  • 8 September 2026 • 5:00 PM
    Evaluating OPC performance on novel EUV Masks: MoSi vs RuSi multilayer effects on high-NA random logic via designs
    Ling Ee Tan1, Vicky Philipsen1, Werner Gillijns1, Jeroen Van de Kerkhove1, Fergo Treska1, Wonchan Lee1, Christina Baerts1, Bhavishya Chowrira1, Ching-Chung Huang2, Anuja De Silva2
    1imec (Belgium), 2Lam Research Belgium BV (Belgium)
  • 9 September 2026 • 8:00 AM
    Stochastic OPC reducing EUVL failure probabilities by orders of magnitude in computational and in-the-fab experimental validation: learning from the experience (Invited Paper)
    Azat M. Latypov1, Xima Zhang1, Farruh Shahidi1, Ingo Bork1, Fan Jiang1, Nicolas Besset2, Luc Martin3, Nassim Halli3, Stephane Buisson3, Peter De Bisschop4, Werner Gillijns4, Renyang Meng4, Xuelong Shi4, Joost Bekaert4, Ryoung-han Kim4
    1Siemens EDA (United States), 2Siemens EDA (Belgium), 3Siemens EDA (France), 4imec (Belgium)
  • 11 September 2026 • 9:40 AM
    Mitigating pattern collapse in metal oxide and chemically amplified resists using a sublimation-based rinse process
    Elke Caron1, Seungjoo Baek1, Wesley Zanders1, Akihide Shirotori1, Satoshi Shindo2, Masahiko Harumoto2, Seonggil Heo3, Jelle Vandereyken3
    1SCREEN SPE Germany GmbH (Belgium), 2SCREEN Semiconductor Solutions Co., Ltd. (Japan), 3imec (Belgium)
  • 9 September 2026 • 8:30 AM
    Wafer topography effects on CD, LER, and FFL in high-NA EUV lithography
    Robert Seidel1, Florian Gstrein1, Gurpreet Singh1, Marta Anguera-Antonana1, Kshitij Sharma1, Aditya Bojja Reddy2, Mircea Dusa2, Wim Bouman3
    1Intel Corp. (United States), 2imec (Belgium), 3ASML Netherlands B.V. (Netherlands)
  • 9 September 2026 • 10:40 AM
    Shorter wavelengths, longer electron paths: A balanced perspective beyond EUV lithography
    Alessandro Vaglio Pret1, Danilo De Simone2, Yi Liu3, John Biafore3, Roel Gronheid4, Bruce Smith5
    1KLA Corp. (Italy), 2imec (Belgium), 3KLA Corp. (United States), 4KLA Corp. (Belgium), 5Rochester Institute of Technology (United States)
  • 8 September 2026 • 3:40 PM
    Why chemically amplified resists extension is critical for early High-NA EUV insertion into HVM?
    Balakumar Baskaran1, Guillaume Schelcher1, Marc Demand2, Yusuke Wako3, Nayoung Bae4, Bhavishya Chowrira1, Xiang Liu5, Soichiro Okada6, Simon Peters2, Sujan Sarkar1, Joern-Holger Franke1, Van Tuong Pham1, Ken Ando5, Arame Thiam2, Victor M. Blanco Carballo1, Kathleen Nafus7, Satoru Shimura6, C. K. Chen8, Tsann-Bim Chiou8
    1imec (Belgium), 2Tokyo Electron Europe Ltd. (Belgium), 3Tokyo Electron Europe Ltd. (Japan), 4TEL Technology Ctr., America, LLC (United States), 5Tokyo Electron Ltd. (Japan), 6Tokyo Electron Kyushu Ltd. (Japan), 7Tokyo Electron America, Inc. (United States), 8ASML Taiwan Ltd. (Taiwan)
  • 11 September 2026 • 10:50 AM
    Enabling pitch 28nm curvilinear patterning in 0.33 NA EUV: integrated lithography, etch, and metrology framework
    Federica Luciano1, Balakumar Baskaran1, Kenichi Miyaguchi1, Viktor Kampitakis1, Soobin Hwang1, Shruti Jambaldinni2, Anuja De Silva2, Bappaditya Dey1, Gianluca Martini1, Jirka Schatz3, Wolfgang Hoppe3, Chih-I Wei4, Ryoung-Han Kim1, Kurt Ronse1, Victor M. Blanco Carballo1, Darko Trivkovic1, Sandip Halder1
    1imec (Belgium), 2Lam Research Belgium BV (Belgium), 3Synopsys GmbH (Germany), 4SNPS Belgium B.V. (Belgium)
  • 8 September 2026 • 4:00 PM
    First 0.55 NA EUV lithography results with non-fluorine biomass EUV resist
    Kazuyo Morita1, Yuki Yanagisawa1, Yana Medvedeva2, Mohamed Zidan2, Yuki Yoshikura1, Harumi Sunaga1, Yuki Tamura1, Sotaro Fukumoto1, Daiki Watai1, Jelle Vandereyken3, Ryuichi Saito1
    1Oji Holdings Corp. (Japan), 2Oji Holdings Corp. (Belgium), 3imec (Belgium)
  • 8 September 2026 • 4:20 PM
    Extendibility of 3D engineered resist films for 0.55 NA EUV Lithography: bright field hexagonal contact holes and random via patterning
    Shruthi Santhosh Nair1, Wonchan Lee1, Ching-Chung Huang2, Mihir Gupta1, Ling E. Tan1, Zhengtao Chen2, Hyo Seon Suh1, Anuja De Silva3
    1imec (Belgium), 2Lam Research Belgium BV (Belgium), 3Lam Research Corp. (United States)
  • 8 September 2026 • 5:00 PM
    Evolution of latent images and nanomechanical properties of metal oxide resists through EUV processing
    Dowon Kim1, Kevin Dorney1, Albert Minj1, Nemanja Peric1, Peter De Wolf2, Cassandra Phillips2, Ivan Pollentier1, John Petersen1
    1imec (Belgium), 2Bruker Nano, Inc. (United States)
  • 11 September 2026 • 8:20 AM
    Material and process optimization of dry resists for high‑NA EUV patterning using a Ru direct metal etch (DME) electrical test vehicle
    Zhengtao Chen1, Ali Haider1, Shruti Jambaldinni1, Anuja De Silva1, Elisabeth Camerotto1, Etienne de Poortere2, Victor M. Blanco Carballo3, Martin O'Toole4, Danilo De Simone3, Stefan Decoster3, Alejandro Berdonces Layunta3, Cyrus Tabery5, Tsann-Bim Chiou6
    1Lam Research Belgium BV (Belgium), 2ASML Leuven (Belgium), 3imec (Belgium), 4ASML Leuven (Belgium), 5ASML (United States), 6ASML Taiwan Ltd. (Taiwan)

ORGANIZATION

• Photomask Technology Chair
  Vicky Philipsen, imec (Belgium)
• International Conference on Extreme Ultraviolet Lithography Chair
  Kurt G. Ronse, imec (Belgium)