September 09 - 10, 2026 | Antwerp, Belgium
Bridging innovation, shaping the next chapter of chip collaboration
IC-Link and imec will be participating in Taiwan-Europe Chip Innovation Forum (TECIF) 2026, an event that brings together industry, research, and policy leaders from Taiwan and Europe to exchange knowledge, build partnerships, and address shared challenges. IC-Link is imec's division for custom chip manufacturing, covering ASICs, PICs, custom wafer processing and advanced packaging.
Join us to learn more on imec’s latest R&D breakthroughs and the manufacturing options through IC-Link:
PRESENTATIONS