/Taiwan-Europe Chip Innovation Forum (TECIF) 2026

Taiwan-Europe Chip Innovation Forum (TECIF) 2026

September 09 - 10, 2026 | Antwerp, Belgium

Bridging innovation, shaping the next chapter of chip collaboration

IC-Link and imec will be participating in Taiwan-Europe Chip Innovation Forum (TECIF) 2026, an event that brings together industry, research, and policy leaders from Taiwan and Europe to exchange knowledge, build partnerships, and address shared challenges. IC-Link is imec's division for custom chip manufacturing, covering ASICs, PICs, custom wafer processing and advanced packaging. 

Join us to learn more on imec’s latest R&D breakthroughs and the manufacturing options through IC-Link:

PRESENTATIONS

  • KEYNOTE 1
    Philippe Absil - Vice President, IC-Link | imec silicon solutions
    Sep 9 | 09:20 - 10:00
  • SIG Session: Silicon Photonics and Advanced Packaging
    Peter Ossieur - Director, XTCO Fabric and Optical Interconnect
    Philippe Soussan - Technology Portfolio Director
    Sep 10 | 13:20 - 15:40