CMOS: advanced and beyond
Discover why imec is the premier R&D center for advanced logic & memory devices.
Integrated photonics
Take a look at technologies for optical transceivers, sensors and more.
Health technologies
See how imec brings the power of chip technology to the world of healthcare.
Sensing and actuation
Explore imec’s CMOS- and photonics-based sensing and actuation systems.
Connectivity technology
Look into our reliable, high-performance, low-power network technologies.
More expertises
Discover all our expertises.
Research
Be the first to reap the benefits of imec’s research by joining one of our programs or starting an exclusive bilateral collaboration.
Manufacturing
Go from idea to scalable and reliable semiconductor manufacturing with IC-Link.
Venturing
We create and co-create new ventures, and we invest in and accelerate existing ventures.
Education and workforce development
Imec supports formal and on-the-job training for a range of careers in semiconductors.
NanoIC pilot line
Aligned with the EU Chips Act, access to the pilot line will accelerate beyond-2nm innovation.
Taiwan-Europe Chip Innovation Forum (TECIF) 2026
September 09 - 10, 2026 | Antwerp, Belgium
Bridging innovation, shaping the next chapter of chip collaboration
IC-Link and imec will be participating in Taiwan-Europe Chip Innovation Forum (TECIF) 2026, an event that brings together industry, research, and policy leaders from Taiwan and Europe to exchange knowledge, build partnerships, and address shared challenges. IC-Link is imec's division for custom chip manufacturing, covering ASICs, PICs, custom wafer processing and advanced packaging.
Join us to learn more on imec’s latest R&D breakthroughs and the manufacturing options through IC-Link:
PRESENTATIONS
- The Photonic Fabric, a heterogeneous integration challenge
Keynote I
Philippe Absil - Vice President, IC-Link | imec silicon solutions - TW-EU Session I & II
Romano Hoofman - Strategic Development Director, General Manager/ imec, EUROPRACTICE - Advancing 2D Materials Toward Electronic Devices and Applications
SIG Session: Smart Sensing
Pierre Morin - Scientific Director - INTRO
SIG Session: Silicon Photonics and Advanced Packaging
Peter Ossieur - Director, XTCO Fabric and Optical Interconnect - 3D Integration & packaging technologies for high bandwidth Optics
SIG Session: Silicon Photonics and Advanced Packaging
Philippe Soussan - Technology Portfolio Director