Fujifilm Develops PFAS-Free*1 Negative ArF Immersion Resist

TOKYO, July 15 2025 – FUJIFILM Corporation today announced that it has developed a PFAS-free negative-type ArF immersion resist for use in advanced semiconductor manufacturing processes. The new PFAS-free ArF immersion resist is a photoresist^*3 designed for negative-type ArF immersion exposure^*4. In collaboration with imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, Fujifilm evaluated the performance of this resist and successfully demonstrated its ability to achieve high yields^*5 in forming 28nm generation^*6 metal wiring, widely used in applications such as automotive and industrial semiconductors. Moving forward, Fujifilm aims to proceed with customer evaluations and target early commercialization.

PFAS is commonly used in the photoresists for ArF immersion exposure, which are widely adopted today, to efficiently generate the acid reactions necessary for drawing fine circuit patterns and to provide a hydrophobic surface on the resist to suppress defects caused by watermarks^*7.  However, increasing awareness of the potential environmental and ecological risks associated with PFAS has led to growing regulatory pressure and a rising demand for alternative materials that do not rely on these substances.

Fujifilm has a history of proactively worked on the reduction and replacement of substances that pose potential risks to human health and the environment. For example, Fujifilm developed the NTI developer solution, which uses highly safe, high-purity organic solvents, marking the world's first innovation in the negative development process. Additionally, Fujifilm launched a PFAS-free nanoimprint resist last year as a semiconductor material compatible with the advanced semiconductor manufacturing technology known as "nanoimprint lithography." By leveraging the technology and expertise for the development of other advanced resists, including those for EUV, Fujifilm is actively promoting the PFAS-free innovation of advanced resists.

This latest PFAS-free ArF immersion resist was developed by leveraging Fujifilm's extensive expertise as a pioneer in the negative development process using high-purity organic solvents. Utilizing the functional molecular design technology honed through its research and development in silver halide photography, along with the molecular design, organic synthesis, formulation, and analytical technologies cultivated through the development of semiconductor materials such as photoresists, it has achieved excellent reaction efficiency in circuit pattern formation and high hydrophobicity to reduce watermarks during advanced ArF immersion exposure. This ensures the formation of highly uniform, fine circuit patterns. Together with imec, Fujifilm evaluated the performance of this PFAS-free negative-type ArF immersion resist and successfully demonstrated its ability to form fine 28nm-generation metal wiring with high yield and high throughput^*8. Currently, evaluations are underway with customers.

Fujifilm is a global supplier of photoresists, photolithography-related materials^*9, CMP slurries^*10, post-CMP cleaners^*11, thin-film chemicals^*12, polyimides^*13, high-purity process chemicals^*14, and other process materials for semiconductor manufacturing from front-end to back-end processes. Fujifilm is also expanding globally with products such as WAVE CONTROL MOSAIC™^*15, which includes color filter materials for image sensors.

Fujifilm will continue to contribute to the development of the semiconductor industry by providing one-stop solutions to solve customers' issues through our broad product lineup that covers almost all areas of the semiconductor manufacturing process, from cutting-edge to legacy nodes, as well as by leveraging its global stable supply system with manufacturing bases in major countries in Japan, the United States, Europe and Asia and its advanced research and development capabilities.

*1 PFAS refers to a collective term for perfluoroalkyl compounds, polyfluoroalkyl compounds, and their salts, as defined in the OECD's 2021 report “Reconciling Terminology of the Universe of Per- and Polyfluoroalkyl Substances: Recommendations and Practical Guidance.” Accordingly, the claim ‘PFAS-Free’ denotes the absence of substances falling within this defined group.

*2 Interuniversity Microelectronics Centre. The world’s largest independent research and innovation center for nanoelectronics and digital technology.

*3 Material used to coat wafer substrate when circuit patterns are drawn in the process of semiconductor manufacturing.

*4 An exposure method using ArF (argon fluoride) excimer laser light (wavelength 193 nm), which is currently the most widely used advanced lithography technology.

*5 The proportion of functional semiconductor chips on a single wafer. Higher yield is achieved when the semiconductor's electrical properties are optimal, and defects are minimal.

*6 The final generation of technology that can be manufactured using single patterning with ArF immersion. Beyond this point, advanced semiconductor manufacturing becomes possible by applying multi-patterning, which involves repeating the patterning process multiple times using the same resist material.

*7 The occurrence of water droplets remaining on the wafer. This can lead to penetration into the resist film or the dissolution of resist material, potentially causing defects.

*8 Processing capacity or productivity per unit of time.

*9 Development solutions, cleaners and other materials used in the photolithography process of semiconductor manufacturing.

*10 A proprietary formulation containing an abrasive that uniformly planarizes semiconductor surface, which contains a mixture of wires and insulation films of varying hardness.

*11 Cleaners used after polishing with CMP slurry to remove particles, minute metal fragments and organic residues while protecting the metal surface.

*12 Materials for forming low-dielectric insulation films.

*13 A material with strong heat resistance and insulation properties, used for forming semiconductors’ protective films and rewiring layer.

*14 High-purity chemicals used in the cleaning and drying processes. The chemicals are employed to remove contaminants during the cleaning and drying stages of semiconductor manufacturing, as well as to eliminate metals and oils during the etching process.

*15 General term referring to a group of functional materials for controlling electromagnetic light waves in a broad range of wavelengths, including photosensitive color materials for manufacturing color filters for image sensors such as CMOS sensors, used in digital cameras and smartphones.