Socionext and imec Update Core Partner Program Strengthening Collaboration in Research and Development of Chiplet and Advanced Logic Semiconductor Technologies

Yokohama, Japan, September 11, 2025 - Socionext Inc. today announced the renewal of its cooperative research agreement for the Core Partner Program with imec, the world's largest independent research institute and innovation center in nanoelectronics and digital technologies. Through its participation in the Core Partner Program, Socionext has been promoting research activities in Design-Technology Co-Optimization and System-Technology Co-Optimization, for leading-edge logic semiconductor and 2.5D/3D leading-edge packaging. With the renewed agreement, Socionext will expand its activities in 3D advanced packaging technologies in order to obtain a wide range of knowledge on the reliability of chiplets, and further strengthen its research activities in chiplet demonstration design, for applications including automotive. Socionext will utilize these knowledge and technologies to deliver high-precision, high-quality leading-edge semiconductor products.

The advancements in various industries in recent years have been driven by the evolution of computing power capable of processing huge amounts of data instantaneously, and semiconductor technology at its core is also becoming increasingly advanced. Chiplets and 3D heterogeneous integration to flexibly respond to workload and application requirements, process technologies evolving to Angstrom nodes, as well as advanced logic semiconductor technologies to enable high-density mounting including backside wiring technologies by are all essential.

The design and development of devices utilizing these advanced technologies are required addressing thermal and mechanical strength issues, along with highly efficient design to reduce skyrocketing development and manufacturing costs.
Especially for automotive chiplets, consideration of physical mechanism as well as a deep understanding of manufacturing technology becomes important to ensure high reliability.

Through this enhanced collaboration with imec, Socionext will deepen its access to cutting-edge technologies and strengthen its ability to develop products that meet the needs of innovative customers in our focus areas, including advanced SoCs for automotive applications.

Socionext promotes its “Solution SoC” business model, which enables to differentiate customer products by engaging from the upstream stages of product development, tailored to each customer’s specific needs. The company provides complete services covering system design, production, supply and quality control. It is essential to maximize the utilization of the open ecosystem to achieve growth and development under this business model, and the company will continue to strengthen collaborations with EDA tool and manufacturing partners including those participating in imec research program.

“Since its establishment in 2015, Socionext has continuously participated in the imec Core Partner Program and accumulated a wealth of knowledge,” said Hisato Yoshida, President and COO of Socionext. “By further promoting the collaboration with imec announced today, we aim to contribute to global innovation while also focusing on nurturing engineers equipped with the world’s most advanced technological capabilities.”

“We are very pleased to extend our partnership with Socionext in our Core Partner Program,” said Luc Van den hove, President and CEO of imec. “It is a confirmation that imec brings application focused value related to design, development and manufacturing for fabless and system companies. Socionext is an important partner that shares this vision. Imec will continue to work closely with Socionext to drive innovation across the semiconductor value chain.”