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Jade Liu

Jim Morgan and Lip-Bu Tan Receive imec’s Lifetime of Innovation Award 

Wouter Charle

Hyperspectral imaging for microsurgery

Blog

The idea of using hyperspectral cameras in surgical practice is not new – but several issues have prevented the technology from being integrated into hospitals’ workflows.

Imec’s hyperspectral cameras come in the form of robust, yet compact, devices. And since they build on the same process used to create microchips, they are mass-manufacturable, cost-efficient, and highly customizable.

Research shows that the technology can be leveraged for the in vivo identification of low-grade gliomas.

Hyperspectral Imaging: Microsurgery’s Next Big Thing

Steven Scheer

Vision

In this interview, Steven Scheer, senior vice president of Advanced Patterning, Process and Materials at imec, highlights challenges and innovations that will mark the field of patterning in the short and longer term.

He explains how these are driven by the advent of High NA extreme ultraviolet lithography (EUVL), the rise of new memory and logic device concepts, and the need to reduce the environmental impact of IC manufacturing.

Challenges and innovations in patterning

Imec’s virtual fab underpins strategies to reduce the carbon footprint of lithography and etch process steps

Imec researchers pave the way for commercial mmWave fixed wireless access (FWA) deployments

Low-power phase-locked loop for short-range applications

Duty-cycled phase-locked loop enables fast generation of high-quality frequency-modulated signals relevant for 140GHz radar applications

Imec demonstrates low-power phase-locked loop for short-range automotive and industrial radar applications

SOT-MRAM opens doors to high-density last-level cache memory

Sebastien Couet

Gouri Sankar Kar

First demonstration of field-free, gate-voltage assisted SOT-based switching operation in a multi-pillar configuration

Research update

Today, three main issues challenge the use of spin-orbit torque magneto-resistive random-access memory (SOT-MRAM) devices in last-level cache memory applications: scalability, dynamic power consumption, and the need for a manufacturable compact field-free switching solution.

At the 2022 IEDM, imec presented a novel SOT-MRAM architecture that solves these issues in one go.

The design improvements, in combination with a high switching speed and &gt;1012 endurance, make the novel device an attractive alternative to SRAM in embedded memory applications.

Novel SOT-MRAM architecture opens doors to high-density last-level cache memory applications

The future of UWB: reconciling sensing with low energy consumption and high bitrates

Christian Bachman

Minyoung Song

Featured in the media

The Future of UWB: Reconciling Sensing with Low Energy Consumption and High Bitrates

Philippe Vereecken

“Use your imagination, it’s one of your most powerful assets.”

Testimonial

<ul>
	<li>Obtained a PhD in Chemistry in 1998</li>
	<li>Postdoctoral associate at The Johns Hopkins University, Baltimore, MD until 2001</li>
	<li>Research staff member at IBM Research in Yorktown Heights, NY</li>
	<li>Joined imec in 2005</li>
	<li>Appointed scientific director in 2018</li>
	<li>Professor at the Faculty of Bioscience Engineering of the KU Leuven since 2009</li>
	<li>Imec fellow since 2022</li>
</ul>

Meet imec fellow Philippe Vereecken

With the growing use of artificial intelligence to tackle the major challenges of our time, the computing need is expected to double every six months from now on.

To handle the exponentially growing amounts of data in a sustainable way, we need improved high-performance semiconductor technology.

While no company in the world can accomplish this alone, co-innovation and collaboration across the semiconductor ecosystem will enable the continuation of Moore’s law.

Smaller, better, faster: imec presents chip scaling roadmap 

Co-integration of high-quality SiN waveguides with active silicon photonics

Imec demonstrates the co-integration of its high-quality SiN waveguide technology with its active silicon photonics platform

Imec hyperspectral camera paves the way for in-vivo detection of low-grade gliomas

VIS & NIR spectral camera with hi-res RGB sensor

Imec demonstrates combined VIS & NIR spectral camera system, complemented with hi-res RGB imaging, for data acquisition at video rate

Stories

Jim Morgan and Lip-Bu Tan Receive imec’s Lifetime of Innovation Award

Hyperspectral Imaging: Microsurgery’s Next Big Thing

Challenges and innovations in patterning

Imec’s virtual fab underpins strategies to reduce the carbon footprint of lithography and etch process steps

Imec researchers pave the way for commercial mmWave fixed wireless access (FWA) deployments

Low-power phase-locked loop for short-range applications

SOT-MRAM opens doors to high-density last-level cache memory

The future of UWB: reconciling sensing with low energy consumption and high bitrates

Meet imec fellow Philippe Vereecken

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