Next-gen silicon microdevices: key technologies and fabrication processes
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Next-gen silicon microdevices: key technologies and fabrication processes

An advanced sensor or complicated micro-mechanical system (MEMS) is the ideal way to shrink form factors and reduce power consumption, lower costs, and increase robustness.

But especially if you need processes and technologies that are not in the mainstream manufacturing toolbox, you’re embarking on an uncertain journey.

Read this white paper to:

  • Take a peek at what goes on at one of the world’s leading R&D centers.
  • Gain insight into key technologies and processes for innovative microdevices.
  • Find out which development path ensures a manufacturable product.

After a general introduction of microdevices, this unique document dives into topics such as 3D integration, silicon photonics, and the incorporation of exotic materials in a CMOS workflow – all illustrated with cases of advanced applications and their challenges.

Complete this form to receive the white paper in your mailbox immediately