ATTOsecond Spectro-microscopies for Photoresist Improvement and Efficacy
Since the first integrated circuit (IC) was produced more than 60 years ago, ICs have revolutionised our lives. They are ubiquitous, found in smartphones, televisions, laptops, cameras, computers, and so much more. Manufacturing technologies are now hitting a roadblock. Extreme ultraviolet (EUV) lithography is a promising printing process for high-volume manufacturing of ICs, yet the exact mechanism of the lithographic process is not well understood due to a lack of metrology techniques that can capture the complex chemistries that occur in EUV lithography. The EU-funded ATTO-SPIE project will develop innovative metrology techniques that will aid in the understanding of the EUV lithographic process while also providing fundamental insights that will enable enhanced control of outcomes in EUV lithographic printing.