CMOS: advanced and beyond
Discover why imec is the premier R&D center for advanced logic & memory devices.
Integrated photonics
Take a look at technologies for optical transceivers, sensors and more.
Health technologies
See how imec brings the power of chip technology to the world of healthcare.
Sensing and actuation
Explore imec’s CMOS- and photonics-based sensing and actuation systems.
Connectivity technology
Look into our reliable, high-performance, low-power network technologies.
More expertises
Discover all our expertises.
Research
Be the first to reap the benefits of imec’s research by joining one of our programs or starting an exclusive bilateral collaboration.
Foundry services
Build on our expertise for the design, prototyping and low-volume manufacturing of your innovative nanotech components and products.
Venturing and startups
Kick-start your business. Launch or expand your tech company by drawing on the funds and knowhow of imec’s ecosystem of tailored venturing support.
Education and workforce development
Imec supports formal and on-the-job training for a range of careers in semiconductors.
NanoIC pilot line
Aligned with the EU Chips Act, access to the pilot line will accelerate beyond-2nm innovation.
AI-Enhanced Intelligent Flow Development for 2D and 3D ASIC Design Optimization
Leuven | More than two weeks ago
AI in 3D ASIC Design
The semiconductor design field is undergoing a significant transformation driven by the integration of Artificial Intelligence (AI) and Machine Learning (ML). IMEC is at the forefront of cutting-edge research in ASIC design, focusing on developing an innovative and highly automated Place and Route (P&R) flow for ASIC designs, including both 2D and 3D implementations. This internship opportunity is centered on harnessing AI and ML to revolutionize ASIC design.
AI and ML are pivotal in addressing the increasing complexity of modern ASIC designs, as they enable the optimization of power, performance, and area parameters. By analyzing extensive datasets, AI-driven algorithms can predict optimal configurations efficiently, leading to faster time-to-market and reduced design iterations. These technologies also offer adaptability, allowing designers to handle evolving challenges and emerging technologies effectively.
The internship project extends beyond conventional 2D designs to include the development of AI-enhanced P&R flows tailored for 3D implementations. This encompasses addressing unique challenges associated with state-of-the-art 3D designs, such as thermal management and signal integrity, while optimizing power, performance, and area parameters. Ultimately, this internship provides a unique opportunity to contribute to the AI and ML revolution in ASIC design, empowering designers with intelligent tools for enhanced efficiency and addressing the intricacies of 3D integration.
Type of project: Combination of internship and thesis
Duration: 6 - 9 months
Required degree: Master of Engineering Technology, Master of Science, Master of Engineering Science
Required background: Electrotechnics/Electrical Engineering, Computer Science, Nanoscience & Nanotechnology
Supervising scientist(s): For further information or for application, please contact: Sudipta Das (Sudipta.Das@imec.be) and Dwaipayan Biswas (Dwaipayan.Biswas@imec.be)
Imec allowance will be provided for students studying at a non-Belgian university.