PhD internship, Master internship - Leuven | Just now
Current memory systems and hierarchies are struggling to keep pace with modern workload demands, especially those imposed by generative AI models. On-chip, SRAM scaling has stagnated due to physical scaling limits in advanced fabrication nodes. Meanwhile, off-chip, DRAM scaling is slowing due to challenges in layout and connectivity. As a result, novel memory technologies must be considered wholistically, both in terms of the technology proposition and the application-driven use case.
imec works to identify and evaluate novel memory technologies, organizations, integrations, and packaging, including but not limited to string memories such as charge-coupled device memories (CCD), flash memories, embedded DRAM, ferro-backed memory, and others. On the Technology-Application Co-Optimization for Systems (TACOS) team, we specialize in end-to-end exploration of these memories and alternatives, i.e. from technology to application mapping, by using system-technology co-optimization (STCO) methodologies.
This internship proposes the exploration of such memories from a co-design point of view, including both top-down (establishing technology requirements) and bottom-up (establishing application paradigm shifts) approaches. During this internship the candidate will be responsible for,
This role is ideal for someone who is deeply interested in hardware-software-technology codesign, memory architecture, and working in an interdisciplinary environment that values innovation, creativity, and real-world impact.
Type of internship: PhD internship, Master internship
Duration: 6-12 months
Required educational background: Electromechanical engineering, Computer Science, Electrotechnics/Electrical Engineering
University promotor: Chris Van Hoof (KU Leuven)
Supervising scientist(s): For further information or for application, please contact Joshua Klein (Joshua.Klein@imec.be)
The reference code for this position is 2026-INT-297. Mention this reference code in your application.
Imec allowance will be provided.
Applications should include the following information: