Master projects/internships - Leuven | Just now
Advances in photonics packaging technology are enabling products consisting of multiple photonic dies interfaced together within a single packaged assembly. A critical aspect for this technology is the reliable bonding of photonics components using optical underfill materials. Optical underfills play a crucial role in mechanical stability of the package as well as functioning as an interface for optical interconnects located on separate dies. However, the complex rheological and wetting behavior of commercial optical underfill materials poses a significant challenge in predicting the capillary filling process particularly in sub-micron size gaps required for relevant photonic applications.
The primary objective of this research is to experimentally investigate the influence of optical underfill properties on capillary flow within a nanogap. Specific objectives include:
During the experimental studies, the following will be conducted by the student:
Prospective candidates should have a keen interest in hands-on experimental work. Ambition to learn and willingness to develop new skills are critical. Prior background in fluid mechanics (either in academic studies or practical experience) is highly preferred. At imec, the selected candidate will work in a diverse, dynamic, multi-disciplinary team and gain expertise in the challenges of semiconductor manufacturing, setting the stage for a fruitful career in R&D supporting a high tech industry.
Type of project: Thesis
Duration: 6 to 12 months
Required degree: Master of Engineering Science
Required background: Mechanical Engineering, Chemistry/Chemical Engineering, Electromechanical engineering, Materials Engineering
Supervising scientist(s): For further information or for application, please contact: Naghmeh Fatemi (Naghmeh.Fatemi@imec.be)
Only for self-supporting students.