Optimization of inline SEM Cross-Section Preparation and Inspection

Optimization of inline SEM Cross-Section Preparation and Inspection

Scanning Electron Microscopy (SEM) is an essential metrology technique in semiconductor manufacturing, enabling high-resolution imaging of device structures and material layers. Both top-view and cross-sectional SEM inspections are widely used to monitor process quality and support technology development.

This thesis focuses on developing and optimizing a workflow for inline SEM cross-section inspections. The student will investigate and optimize the key preparation and inspection steps, including sample capping, cross-section cutting, and SEM imaging. Various imaging parameters such as pixel resolution, dwell time, line integration, and image integration will be evaluated to determine their impact on image quality.

Based on experimental results, objective image quality criteria will be defined and used to identify the optimal inspection conditions. The student will also develop standardized pattern and beam templates to establish a robust and uniform methodology for inline SEM cross-section analysis.

This project offers hands-on experience with advanced semiconductor metrology tools and provides an opportunity to contribute directly to the optimization of inspection methods used in a state-of-the-art semiconductor fabrication environment.