Sub-THz Packaging solution for High-Bandwidth Wireline applications in Datacenter, HPC, and Optical Platforms

The rapid growth of AI, high-performance computing, and cloud systems is pushing existing electrical I/O technologies to their limits. At data rates above 100–200 Gb/s per lane, traditional pluggable optical modules struggle with power consumption, signal loss, and bandwidth density. Co-Packaged Optics (CPO) integrates optical transceivers directly onto the package or interposer, reducing electrical path lengths and enabling lower power and higher bandwidth operation. This approach requires advanced RF and mixed-signal interposer and packaging technologies with ultra-low-loss routing, embedded passives, and tight electronic–photonic integration.

This master’s thesis will focus on:

• Developing low-loss, high-density routing for ASIC–Driver–PIC links using imec RF and mixed-signal interposer/packaging platforms.

• Designing high-Q inductors, capacitors, and impedance-matching networks.

• Designing and simulating high-speed SerDes channels with low jitter and high energy efficiency