A crucial part of future integrated and high-throughput genomic solutions, is the sensor chip packaging and system-integration. A cartridge needs to be manufactured around the chip with in- and outlets to allow interaction with the outside world. This includes electrical and photonic signals and fluid ins and outs.
There is not yet a standard sensor/microfluidic/cartridge integration solution available like for semiconductor chips. For each application, a tailored solution can be worked out.
In this webinar, we touch upon different packaging solutions, also the more advanced ones that are used in chip manufacturing. Imec, with both R&D, chip manufacturing and packaging capabilities in house, is ideally placed to make such platform choices and to build solutions. Our large toolset of analysis equipment is also an important asset to gain insight into pros and cons of certain material and process parameter choices, thereby removing the risk of incompatibilities at all levels.
We discuss die-to-die packaging and wafer-level packaging, described from a cost and performance point of view to illustrate their importance for future genomic solutions.
Riet Labie is Program Manager “Materials and Interconnects” at imec. She graduated in 1999 as master in Materials Science and Engineering at the University of Leuven (KU Leuven) and joined imec next. After a few years of working as thin film process engineer, she obtained a PhD in 2007 after which she continued working as researcher and R&D project leader on different topics including material characterization and reliability, wafer-level processing and packaging, 3D-stacking of Si devices, photovoltaics and board-level assembly. After 15 years of research, she moved from imec’s research unit to Imec Solutions to participate in the development and industrialization of dedicated application demands. Her current activities mainly focus on manufacturability of micro-electronics integration solutions, including microfluidic functionality.