Interview: semiconductors for next-gen mobile technology
Imec experts Nadine Collaert and Michael Peeters talk to David McClelland from Mobile World Live.
Two performance dimensions are key when we talk about next-generation mobile communication systems: throughput and power efficiency.
Both are expected to improve significantly. This webinar zooms in on what this means for the radio hardware of beyond 5G systems. It specifically demystifies less-understood aspects such as semiconductors, and the integration and packaging for mobile devices vs. infrastructure.
Heterogeneous integration
For frequencies of mmWave and higher, we have reached the limit of what current silicon technologies can enable. Much like the semiconductor industry runs against the limits of Moore for scaling, the Johnson figure of merit makes us rethink mobile communication technologies.
One of the favored solutions is to blend different technologies to achieve benefits at the system level. Heterogenous integration is rapidly becoming important for the future roadmap of mmWave and sub-THz communication and sensing front ends.
In this interview, imec experts Nadine Collaert and Michael Peeters share the latest developments and timelines of CMOS and III/V semiconductors, crucial to developing a robust mobile technology strategy.
Speakers
Nadine Collaert is a program director at imec. She's currently responsible for the analog/RF program looking at the heterogeneous integration of III-V/III-N devices with advanced CMOS to tackle the challenges of next-generation mobile communication. Previously, she was a program director of the logic beyond Si program, focused on researching novel CMOS devices and new-material-enabled devices and system approaches to increase functionality. She has been involved in the theory, design, and technology of FinFET devices, emerging memories, transducers for biomedical applications, and the integration and characterization of biocompatible materials. She has a Ph.D. in electrical engineering from the KU Leuven, (co-)authored more than 400 publications, and holds more than ten patents in device design and process technology.
Michael Peeters is vice president of imec's R&D activities in the connectivity domain. He has authored more than 100 peer-reviewed publications and multiple white papers. Michael holds various patents in the access networks and photonics domains. He holds a Ph.D. in Applied Physics and Photonics from Vrije Universiteit Brussel as well as a master’s degree in Electrotechnical Engineering.
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