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3D structure and composition analysis by using delayering technique
Leuven | More than two weeks ago
Explore new etch process solution
§Problem statement, challenge
§Current inspection has limited
information (one planar), slow turnaround time and no statistic
information
§Limited understand about side wall
passivation polymer control mechanism
§Research objectives, goals
§Understand more detail of etch
profile impact on 3D structure
§Understand polymer deposition
location control by etch parameter
§Methodology/workplan
§Delayering technique with
EDX/CD-SEM...
§Gap: Delayering metrology set up
required, test pattern wafer, SW coding
Required background: Engineering Technology, Engineering Science, Computer engineering
Type of work: 30% modeling, 30% experimental, 20% programing, 20% literature
Supervisor: Claudia Fleischmann
Co-supervisor: Emmanuel Dupuy
Daily advisor: Emmanuel Dupuy
The reference code for this position is 2024-055. Mention this reference code on your application form.