Antenna design for ESD event detection in 2.5D/3D bonding processes

Electrostatic discharges (ESD) have always been a risk for integrated circuits, and especially so during the bonding and packaging processes. This still holds true for the very advanced 2.5D and 3D bonding processes. Since we cannot measure the ESD events directly, we are developing a method to detect them indirectly, through the electromagnetic radiation they create.

The goal of this work is to design a suitable antenna that will be able to detect the one-nanosecond long ESD pulses and integrate it into the bonding tool chip/wafer holder. To achieve this, knowledge of antenna design will be necessary. Familiarity with 2D or 3D electromagnetic simulators would be welcome. 

You will work in an international team with vast experience in the ESD field, and have access to colleagues for help. Proficiency in English and good communication skills will be appreciated.
 

Type of Project: Combination of internship and thesis; Internship 

Master's degree: Master of Engineering Technology; Master of Engineering Science 

Duration: 3 to 6 months 

Master program: Electrotechnics/Electrical Engineering 

Supervising scientist(s): For more information or application, please contact Marko Simicic (marko.simicic@imec.be) and Nicolas Pantano (nicolas.pantano@imec.be)

Imec allowance will be provided for students studying at a non-Belgian university.