Circuit Designer: III-V Electronics

Circuit Designer: III-V Electronics

What will you do:

Next generation communication and radar systems will operate at frequencies beyond 100 GHz. At such high frequencies, traditional interconnect solutions based on PCBs incur excessively high loss and leakage of signal. Furthermore, larger antenna arrays are needed to overcome higher path loss, low amplification, and low absolute power from transistors. Heterogeneous integration of different transistor technologies and passive components is essential to meet link budget and high data rate requirements at these frequencies.

Imec USAis looking for anexpert with circuit design experience in III-V electronics (InP, GaN, GaAs) with a focus on mm-wave and sub-terahertz applications to contribute to imec’s roadmap on next generation phased array systems. You will be integrated into imec’s Advanced RF cross-site team across Kissimmee (Florida) and Leuven, (Belgium) and work together with other experts from hetero-integration, circuit design and technology development teams. Literature survey and keeping an up-to-date list of recent (academic and industry) developments in this field will be an additional task.

Your tasks will include:

·       Circuit simulation and optimization of active building blocks for mm-wave circuits

·       Knowledge of layout, parasitic extraction, and EM-circuit co-simulation and their use to understand / mitigate high frequency effects in circuit design

·       Contribute to tape-outs as part of various test vehicles and demonstrator development

·       You will be based in Kissimmee, Florida but open to travel to Leuven, Belgium for technical discussions, training and brainstorming

About you:

·       Strong background in mm-wave circuit design with focus on III-V electronics

·       Knowledge of mm-wave circuit simulation of basic building blocks (power amplifier, oscillator, multiplier etc.)

·       Proficient in circuit simulators like Keysight ADS, Cadence Microwave Office and Virtuoso

·       Knowledge of heterogeneous integration and mm-wave packaging will be an additional advantage

·       PhD or a Master’s degree with 3+ years of relevant job experience

·       Very good English language skills (written and spoken)