Electrochemically induced deposition of functional silica nanocomposite dielectrics for semiconductor devices

This PhD project aims to develop a new electrochemically based deposition platform for advanced dielectric materials that can overcome key limitations of conventional chemical vapor deposition in semiconductor manufacturing. The research will focus on the deposition of advanced dielectric coatings on complex three-dimensional structures, including wafer bevels and narrow interdie gaps, where precise thickness control, high deposition rates, and defect-free filling are essential. The project will explore the integration of inorganic and organic phases, dopants, and functional additives to create multifunctional dielectric nanocomposites with enhanced mechanical strength, improved thermal management, greater stability, and tunable electrical properties. By establishing fundamental relationships between electrochemical process conditions, material composition, structure, and performance, this work will enable innovative dielectric solutions for next-generation semiconductor integration and advanced computing technologies.