Master projects/internships - Leuven | Just now
Bridge hardware and algorithms—design the next-gen physical layer for 6G wireless.
As the world moves towards 6G, immersive applications like virtual reality are pushing the limits of wireless communication, demanding data rates in the gigabits-per-second range. The sub-THz frequency band (90–300 GHz) is emerging as a critical enabler of such ultra-high-speed wireless systems, thanks to its abundant available bandwidth.
However, operating at these extreme frequencies brings unique challenges. Designing efficient local oscillator at sub-THz frequencies is difficult. Moreover, the imperfection such as phase noise caused by local oscillator can severely degrade system performance. To ensure reliability in future 6G networks, we need robust physical layer designs that can tolerate and even compensate for these hardware impairments.
What You’ll Do:
As part of this thesis, you will contribute by:
While a clear task structure is provided, we highly value your creativity within the topic’s scope. Further, the position can be tailored as full-time/part-time/Thesis/Internship to accommodate your study requirements.
Our department offers a unique collaborative environment, bringing together circuit designers and signal processing engineers. This position provides a rare opportunity to bridge the gap between hardware and algorithm design, giving you valuable insights into how physical layer signal processing is shaped by practical hardware constraints.
Your Profile:
Type of Project: Combination of internship and thesis; Thesis; Internship
Master's degree: Master of Engineering Technology; Master of Engineering Science
Master program: Electrotechnics/Electrical Engineering; Computer Science
For more information or application, please contact the supervising scientists Abdur Mohamed Ismail (abdur.mohamedismail@imec.be) and Sriram Balamurali (sriram.balamurali2@imec.be).
Imec allowance will be provided for students studying at a non-Belgian university.