Plasma/UV polymer cleaning of Graphene and WS2

2D materials (transition metal dichalcogenides, Graphene, etc…) are explored for multiple applications, going from channel material for replacement of Si in CMOS, photonics, sensors etc… In many cases, the processing of 2D materials implies the use of sacrificial polymer films, that need to be removed from the 2D at at certain moment of the process flow. This removal needs to be efficient down to the nanoscale, but also non damaging i.e. with minimal damage to the 2D, in terms of crystalline quality or film stoichiometry. This is particularly challenging for 2D materials, which are only few Angstroms thick and, therefore, can be very sensitive.

The present Master/internship proposal aims at exploring techniques for the cleaning of 2D materials, relying on the experience and expertise gained at imec, in this field, over the last few years.

The candidate will explore the following approaches:

1. Remote H₂ plasma including additives and pulsed discharges
2. UV cure 

The samples will be evaluated using several techniques including: WCA, AFM, Raman spectroscopy and photoluminescence.

The candidate is expected to have some background in semiconductor technology as well as be able to do lab work, including the use of processing tools and basic characterization methods. Under supervision by his/her imec mentor, the candidate is expected to perform experiments based on a pre-established plan, generate data, analyze and interpret the data and summarize it. The candidate must be fluent in English. 50% of the work is done in the lab, the remaining is about data analysis and characterization, making presentations and literature survey.