Power devices cointegrated on package/chip or BEOL

System scaling constraints on power delivery call for enhanced power management through novel power component integration. Back-End-Of-Line (BEOL) compatible devices and hybrid bonding improvements provide viable candidates for such integrated power devices. For example, hybrid integration with highly performant technologies such as GaN provides an opportunity for integrated DC-DC converters, whereas BEOL compatible technologies such as IGZO and 2D grant promising candidates for power switches and LDO. Exploring these heterogeneous power delivery applications requires cell-level models and optimization.

In this PhD, you will assess various power management innovations, identify device opportunities and optimize power components enabling these innovations. You will explore various technology options, physical design space, and integration with BEOL and/or hybrid bonding from a pathfinding, forward looking perspective.

You will develop cell-level models for various technology options, leveraging imec’s existing DTCO modeling framework. The active part of the device will be modeled through TCAD simulations, and a compact model (CM) fitted to the subsequent TCAD data, whereas the Mid-Of-Line (MOL) parasitics will be modeled through parasitic extraction (PEX) using a full-field 3D solver. You will use these cell-level models to benchmark different technology options for a specified power component.

You will analyze various power applications and identify the distinct features in the technology architecture with significant impact for every application. Bearing these distinct features in mind, you will assess different technology options, and optimize the presumed devices.