Orbotech’s SPTS Technologies’ Sigma® fxP PVD Solution Selected for imec’s 3D System Integration Program

YAVNE, ISRAEL, July 11, 2017 | ORBOTECH LTD. (NASDAQ: ORBK), today announced that SPTS Technologies, an Orbotech company and supplier of advanced wafer processing solutions for the global semiconductor and related industries, has been named by imec, a world-leading nano-electronics research center, as a new supplier of physical vapor deposition (PVD) solutions for under bump metallization (UBM) and redistribution layer (RDL) processes for next generation fan-out packaging technologies. Imec has selected SPTS’s Sigma® fxP PVD solution as the new process tool of record (PTOR) for low temperature PVD for development of novel fan-out technologies such as flexible micro-bumps for chip scale packaging.

“To meet the technical requirements of future micro- and nano-electronics, novel 3D integrated circuit (IC) architectures need to be developed to meet scaling challenges without compromising cost, performance, and power budgets,” stated Kevin Crofton, President of SPTS Technologies and Corporate Vice President at Orbotech. ”Imec works closely with leading semiconductor companies to develop innovative wafer-level packaging architectures that will meet the performance requirements of next generation devices such as application processors that drive virtual reality applications or enable high performance computing for artificial intelligence. We are proud that imec selected SPTS’ Sigma® for its 3D System Integration Program, reflecting our PVD solutions’ excellent results, particularly in low temperature RDL and copper pillar creation on low temperature tolerant polymers. We look forward to working with imec and its partners in developing innovative interconnect and fan-out technologies.”

Mr Crofton added,” SPTS specializes in UBM/RDL PVD for Flip Chip and fan-out applications, and our low temperature PVD capabilities will support the development of a range of new interconnect technologies at imec, including flexi bumps, to address the scaling and packaging needs of future generations of nano-electronics.”

Dr Anthony Barker, PVD Product Manager at SPTS, will be giving an invited talk titled: “Fantastic Fan-out; Improving Interconnect Productivity for the Fastest Growing Packaging Platform” on Thursday 13 July, 14.00 – 14.30 at the Advanced Packaging Meet the Expert Session, at SEMICON West, in San Francisco.

To learn more about SPTS’s Sigma fxP PVD solutions, and full range of industry leading etch, deposition, and inkjet solutions for advanced packaging applications visit SPTS Technologies on Booth No.7617 in West Hall at SEMICON West, 11 – 13 July, Moscone Center, San Francisco.

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About Sigma® fxP PVD

The Sigma fxP is a cluster PVD system used by device manufacturers in various end markets including power management, MEMS and RF devices. In semiconductor packaging, the Sigma fxP deposits RDL and under bump metals (UBM) for Cu micropillar and TSV’s, plus TSV liner/barrier for 3DWLP. For FOWLP, the system carries a Multi Wafer Degas (MWD) for low temperature, high productivity degas of epoxy mold compound. Its SE-LTX etch module pre-cleans organic films with twice the mean wafers between cleans (MWBC) compared to competing systems.

About Orbotech Ltd.

Orbotech Ltd. is a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products. Orbotech provides cutting-edge solutions for use in the manufacture of printed circuit boards (PCBs), flat panel displays (FPDs), and semiconductor devices, designed to enable the production of innovative, next generation electronic products and improve the cost effectiveness of existing and future electronics production processes. Orbotech’s core business lies in enabling electronic device manufacturers to inspect and understand PCBs and FPDs and to verify their quality, pattern the desired electronic circuitry on the relevant substrate and perform three dimensional shaping of metalized circuits on multiple surfaces, and utilize advanced vacuum deposition and etching processes in SD and semiconductor manufacturing. For further information, visit http://www.orbotech.com and www.spts.com

Cautionary Statement Regarding Forward-Looking Statements

Except for historical information, the matters discussed in this press release are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words “anticipate,” “believe,” “could,” “will,” “plan,” “expect” and “would” and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements. These forward-looking statements are made based on management’s expectations and beliefs concerning future events affecting Orbotech and are subject to uncertainties and factors relating to Orbotech’s operations and business environment, all of which are difficult to predict and many of which are beyond the Company’s control. Many factors could cause the actual results to differ materially from those projected including, without limitation, cyclicality in the industries in which the Company operates, the Company’s production capacity, timing and occurrence of product acceptance (the Company defines ‘bookings’ and ‘backlog’ as purchase arrangements with customers that are based on mutually agreed terms, which, in some cases for bookings and backlog, may still be subject to completion of written documentation and may be changed or cancelled by the customer, often without penalty), fluctuations in product mix, within and among divisions, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate, including as a result of the Brexit process and administration change in the United States, or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smartphones, tablets and other electronic devices as well as automobiles, the Company’s global operations and its ability to comply with varying legal, regulatory, exchange, tax and customs regimes, the timing and outcome of tax audits, including the ongoing process with respect to the $58 million tax assessment for the years 2012-2014 and associated criminal investigation by the Israel Tax Authority (any estimation of the potential outcome of an uncertain tax issue is a matter for judgment, which can be subjective and highly complex; however, the Company believes that it has provided adequately for any reasonably foreseeable outcomes related to the tax audit, but future results may include favorable or unfavorable material adjustments to estimated tax liabilities in the periods when the assessments and investigations are resolved or the audit and investigation are closed), harm to the Company’s reputation from ITA’s investigation and any adverse impact on its business and opportunities, the Company’s ability to achieve strategic initiatives, including related to its acquisition strategy, the Company’s debt and corporate financing activities; the final timing and outcome, and the impact, of the criminal matter and ongoing investigation in Korea, including any impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company’s customers, which may result in monetary judgments or settlements, expenses associated with the Korean matter, ongoing or increased hostilities in Israel and the surrounding areas, and other risks detailed in the Company’s SEC reports, including the Company’s Annual Report on Form 20-F for the year ended December 31, 2016, and subsequent SEC filings. The Company assumes no obligation to update the information in this press release to reflect new information, future events or otherwise, except as required by law.

ORBOTECH COMPANY CONTACTS:

 

Rami Rozen

Tally Kaplan Porat

Director of Investor Relations

Director of Corporate Marketing

Tel: +972-8-942-3582

Investor.relations@orbotech.com

Tel: +972-8-942-3603

Tally-Ka@orbotech.com

 

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