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CMOS: advanced and beyond
Discover why imec is the premier R&D center for advanced logic & memory devices.
Integrated photonics
Take a look at technologies for optical transceivers, sensors and more.
Health technologies
See how imec brings the power of chip technology to the world of healthcare.
Sensing and actuation
Explore imec’s CMOS- and photonics-based sensing and actuation systems.
Connectivity technology
Look into our reliable, high-performance, low-power network technologies.
More expertises
Discover all our expertises.
Research
Be the first to reap the benefits of imec’s research by joining one of our programs or starting an exclusive bilateral collaboration.
Manufacturing
Go from idea to scalable and reliable semiconductor manufacturing with IC-Link.
Venturing
We create and co-create new ventures, and we invest in and accelerate existing ventures.
Education and workforce development
Imec supports formal and on-the-job training for a range of careers in semiconductors.
NanoIC pilot line
Aligned with the EU Chips Act, access to the pilot line will accelerate beyond-2nm innovation.
Semiconductor technology
Life sciences and health solutions
Data and telecommunication
Automotive technologies
Robotics technology for Industry 4.0
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/What we offer/Custom chip manufacturing/Test Labs/Broadband Optical Lab

Broadband Optical Lab

Some examples of what we have done
Some examples of what we have done

The Broadband Optical Lab at IDLab, an imec research group embedded in Ghent University and the University of Antwerp, is a state-of-the-art test and measurement environment for the characterization of high-speed, high-frequency and mixed-signal electronic circuits and (sub-)systems for wireless, wired and fiber-optic communication or instrumentation.

Click here for more info.

Some examples of what we have done

Article Monolithic ASIC vs Chiplet

Longread

When does it make sense to move from a monolithic ASIC to a chiplet-based design?
PR FeFET FeCAP

Press

Breakthroughs in ferroelectric memory research
PR imec Sony

Press

Sony and imec unveil high-density backside connectivity module
PR 2D materials TSMC ASML

Press

2D-material transistors closer to industrial readiness
PR RF Interposer

Press

Imec unlocks system-level III-V chiplet integration on Si-CMOS
Collaboration signing IMEC and TUe
Imec and TU/e formalize a shared vision for semiconductor innovation
PR UWB

Press

Imec unlocks fourfold UWB range extension
PR Hybrid Bonding

Press

W2W hybrid bonding with 200nm interconnect pitch
ACP architecture

Vision

From horsepower to high-performance compute
AI Protein engineering
AI‑driven lab-in-the-loop protein engineering
PR HNA Qubits

Press

World first: quantum dot qubit device using High NA EUV
PR Venturing

Press

Imec expands global footprint of imec.ventures with dedicated US presence

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