/Fundamentals of wet process interactions of complex metal alloys

Fundamentals of wet process interactions of complex metal alloys

PhD - Leuven | More than two weeks ago

Advancing future nanoscale interconnects by unravelling the surface chemistry of metal alloys.

For next-generation advanced interconnects, the material properties of Cu render it unreliable for producing ever more performant chips. Various alternative metals, such as ruthenium, rhodium, and molybdenum, have been studied and start to be implemented by the industry to tackle resistive losses due to the small dimensions of the metal structures. 

To further lower the impact of resistivity at even more aggressively scaled dimensions, complex metal alloys are currently being explored. One of the grand challenges to implement these materials at an industrial scale is related to the surface chemistry properties. Even minor changes in the alloy’s composition have a dramatic impact on the resistivity of nanoscale structures. The presence of multiple metals in the alloy results in a deviating stoichiometry of the alloy in the near-surface region, which results in differences in corrosion and wet etch behaviour. Both the underlying chemical and physical processes involved are, to date, not well understood and characterized.

In the project, focus will be on fundamental understanding of wet processes like post patterning cleaning and Chemical Mechanical Planarization (CMP) which can remove material in a controlled way . In the initial phase of the project, the focus will be on characterizing the surface chemistry to check the influence of the wet chemical process (e.g. concentration of oxidizing agent). Also, the focus will be on the study of the alloy’s electrochemistry, e.g. an in-situ set-up on an experimental tool is used allowing us to study the alloy's electrochemistry during CMP on wafer coupon scaleDuring the entire project, various types of metrology will be used to characterize the material properties (e.g. AFM, XPS, RBS, TEM). 

Required background: master of science (chemistry, material science)

Type of work: 80% experimental, 10% characterization, 10% literature

Supervisor: Stefan De Gendt

Co-supervisor: Harold Philipsen

Daily advisor: Nancy Heylen

The reference code for this position is 2024-038. Mention this reference code on your application form.

Who we are
Accept marketing-cookies to view this content.
Cookie settings
imec's cleanroom
Accept marketing-cookies to view this content.
Cookie settings

Related jobs

Thermal-aware design of advanced interconnects for future technologies

Enable the future technologies for Machine Learning, Artificial Intelligence & High-Performance Computer through microelectronic thermal optimization

System technology co-optimization for high speed/high frequency chiplets and heterogeneous integration packaging

Are you ready to embark on an exciting journey into the cutting-edge world of semiconductors? Today, the semiconductor industry is undergoing a profound transformation, and we invite you to be part of it. Imagine a future where electronics are more powerful, energy-efficient, sus

Pathfinding of emerging VLSI technologies and architectures with imperfect materials and processes

Safeguarding reliable operation of upcoming nanometer technologies

3D materials characterization for next generation devices

Use a multidisciplinary approach to improve the success rate of Atom Probe Analysis

Using 1/f noise to prevent the failure of nanoscale dielectric materials used in state-of-the-art chips

Performing noise-stress-noise measurements up to hard-breakdown, enabling the development of an alternative dielectric lifetime prediction methodology using 1/f noise 

Physics of the fluctuation response of dielectric materials to external electrical perturbations, for advanced interconnects and emerging memories

Making use of 1/f noise and microscopic fluctuations to better understand the fundamental degradation physics of dielectrics used in state-of-the-art nano-electronic chips. 
Job opportunities

Send this job to your email