Optimization of heterogeneous integration platform for 6G applications

Optimization of heterogeneous integration platform for 6G applications

The next generation of communication and radar systems will move beyond 100 GHz because of the need for higher performance, lower latency, small form factor, and lower cost. The traditional interconnect and packaging solutions

based on PCBs will not meet the requirements at such high frequencies. Thus, a cost-effective heterogeneous integration platform is essential for co-integrating mm-wave ICs in different technologies, such as III-V dies to provide power or scaled CMOS for IF/baseband circuitry, enabling the co-design between package, RFIC, and antenna.

In this PHD, the focus will be the technology optimization of the imec heterogeneous integration platform.  You will work together with 3D technology and RF experts on the co-optimization and downscaling of imec RF interposer technology,

to enable the innovative system concepts and system-technology co-design for the next generation of wireless communications

• Investigate the process ability of the alternative low loss low-K polymers, characterize their RF properties.  
• Development of broadband characterization techniques and methods
• Flip chip pitch/topology optimization
• Si substrate loss and mitigation technique
• Modelling/design of various passive components targeting for high frequency
• Literature review and benchmarking the state of the art

You will work with across department teams  in a world class R&D environment. Your daily advisor will be an IMEC scientist Xiao Sun. Your PhD supervisor will be professor Dimitri Lederer from UCL.