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Plasma Dynamic Simulation for Soft X-Ray and Extreme Ultraviolet (EUV) Sources
Master internship - Brussel | Just now
Physics modeling and simulation for a state-of-the-art semiconductor technology
Soft X-ray and Extreme Ultraviolet (EUV) radiation sources play a critical role in advanced technologies such as semiconductor lithography, plasma diagnostics, and nanoscale imaging. These sources are typically generated through laser-produced or discharge-produced plasmas, where complex interactions between high-energy radiation, plasma expansion, ionization kinetics, and radiation transport determine the emission efficiency and spectral characteristics. Recent research emphasizes the importance of numerical modeling and radiation-hydrodynamic simulations to understand plasma formation, optimize target materials, and improve conversion efficiency in EUV sources.
This internship project focuses on the numerical simulation and analysis of plasma dynamics in Soft X-ray and EUV-emitting plasmas. The study will investigate the temporal and spatial evolution of plasma parameters such as electron temperature, density, ion charge states, and radiation emission using computational models. Through numerical experiments, the project aims to explore how different parameters influence EUV and Soft X-ray emission efficiency. The results will provide insight into plasma behavior and optimization strategies for compact high-brightness radiation sources for next-generation photonic and lithographic systems.
Type of internship: Master internship
Required educational background: Physics, Nanoscience & Nanotechnology, Mechanical Engineering, Energy
Supervising scientist(s): For further information or for application, please contact Hyun-su Kim (Hyun-su.Kim@imec.be)
The reference code for this position is 2026-INT-145. Mention this reference code in your application.
Only for self-supporting students.
Applications should include the following information:
- resume
- motivation
- current study
Incomplete applications will not be considered.