Verification, calibration, and evaluation of thermal controlled measurement equipment

For standard IC testing, we typically need electrical input and output.

Temperature measurements are becoming more important in modern way of parametric testing of electronic devices. This is done using a temperature-controlled wafer chuck. This thermo-controlled wafer chuck needs to meet the specified temperature accuracy. Current way of working is a yearly manual temperature calibration of the chuck. A wafer chuck is a plate on which wafers are securely mounted during wafer processing applications.

Goal
 

Goal of this internship is to build a new way of working to get this temperature verification procedure done in an (semi-) automatic way.
 

Step 1: Investigate current way of wafer chuck calibration. 

• This will be done by a service technician.
• You make notes current used procedure.
• Try to address the weakness of current calibration methods (accuracy, timing, ...)
   

Step 2: Systematically eliminate the weaknesses found in step 1

• Is current way of working the best possible?
• Can we change this WoW already?

Step3: Definition of new Way of Working

• Implement the current way of working in a software program.
  • Built software tool (windows based) to run on a laptop.
    • LabVIEW/C/Python/other...
    • Communication with measurement instruments
  • No special operator skill required.
  • Reduction of the overall measurement uncertainty
• Compatible with different prober types and chuck systems (from cold to hot)
• Calibration hardware (sensors/laptop/...) will be provided to you

Language requirements: English

Type of Project: Internship

Manager: Gregor Vercaigne

Mentor: Anchidim Nimigean 

Bachelor's program/required background: engineering technology

For more information or application, please contact the supervising scientists Gregor Vercaigne (gregor.vercaigne@imec.be) and Anchidim Nimigean (anchidim.nimigean@imec.be).