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Imec Demonstrates Power-Performance-Area-Cost Benefit of Heterogeneous Sequential-3D Integration for Advanced CMOS Nodes

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Proteomics technology

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Progress in proteomics

PR High-NA first exposure

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Imec demonstrates logic and DRAM structures using High NA EUV Lithography

Meet imec fellow Jan Craninckx

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Meet imec fellow Jan Craninckx

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Next-generation sensor for multi- and hyperspectral imaging

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Chiplets: Piecing Together the Next Generation of Chips (Part II)

Article ESD protection

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Towards efficient ESD protection strategies for advanced 3D systems-on-chip

Si spin qubits manufactured with state-of-the-art 300mm integration flows.

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Record-low charge noise for Si MOS quantum dots

UV PICs for microscopy

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How ultraviolet photonic integrated circuits transform microscopy

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Chiplets: piecing together the next generation of chips (part I)

Article High-NA EUVL

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Entering the High NA EUV Lithography era

Article CMOS 2.0

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CMOS 2.0: bringing heterogeneity inside the system-on-chip

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Inside imec's N2 P-PDK workshop

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4 December 2017

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