IC-Link by imec expands collaboration with TSMC to accelerate customer access to advanced-node chip design infrastructure and support

LEUVEN (Belgium) and SANTA CLARA (U.S.A.), September 23, 2026— IC-Link by imec, imec’s design and manufacturing service provider for ASICs and silicon photonics, and TSMC today announced an expansion of their collaboration aimed at simplifying customer access to advanced-node semiconductor design capabilities. As the newest member of the TSMC Open Innovation Platform® (OIP) Cloud Alliance, IC-Link will become the first managed-cloud service supporting mixed-partner EDA flow for silicon design. With its cloud offering, IC-Link combines advanced-node technology access, secure cloud-based design capabilities and expert support to help innovators accelerate the path from concept to silicon.

As semiconductor development becomes increasingly complex, design teams face growing pressures related to computing resources, design infrastructure, secure technology and tool access, and time-to-market. The combination of TSMC's industry-leading technology and ecosystem and IC-Link by imec's design enablement expertise aims to ease design complexities for customers developing advanced chips for artificial intelligence, communications, automotive, industrial, and other high-growth applications. Through IC-Link’s secure cloud-based environment, customers gain controlled access to advanced TSMC process design kits (PDKs) while benefiting from scalable compute resources tailored to chip development workloads. The platform supports flexible EDA design flows, enabling customers to use their own preferred tool chains and licenses while IC-Link provides secure hosting, infrastructure management and access to the required design resources. This allows design teams to focus on innovation and product development rather than building and maintaining complex design environments.

The initiative builds on imec’s long-standing relationship with TSMC, including IC-Link’s recent participation in the TSMC Open Innovation Platform® (OIP) 3DFabric® Alliance and further expands the range of IC-Link services available to customers seeking access to advanced semiconductor technologies. In addition, IC-Link has been a TSMC Value Chain Alliance (VCA) member since 2009 and Design Center Alliance (DCA) member since 2007. Access to advanced-node design capabilities remains a critical requirement for many emerging semiconductor companies and research organizations. Strengthening IC-Link’s position as a trusted bridge between semiconductor innovation and manufacturing, the expanded collaboration contributes to broader efforts to enhance semiconductor innovation capacity in Europe and beyond. 

“As chip design continues to increase in complexity, innovators require a holistic solution — advanced technologies, cloud-based infrastructure, design expertise and support— to bring designs to silicon efficiently," said Pierre Blondeau, vice president ASIC Services at IC-Link by imec. "By joining TSMC’s OIP Cloud Alliance, we now combine access to advanced-node technologies with secure mixed-partner EDA flow, cloud-based design capabilities and expert support, making advanced semiconductor innovation more accessible. Together with TSMC, we are helping customers reduce complexity, accelerate development cycles and move more confidently from design concept to end-product."

"TSMC's Open Innovation Platform (OIP) ecosystem is built on collaboration and enables innovation across the semiconductor industry," said Aveek Sarkar, Director of the Ecosystem and Alliance Management Division at TSMC. "We are pleased to further expand our collaboration with IC-Link by imec and support a broader community of innovators seeking access to advanced process and packaging design capabilities. Together with our OIP partners like IC-Link by imec, we aim to help customers bring breakthrough silicon to market faster while leveraging the flexibility, scalability, and security of modern design environments."