Master projects/internships - Leuven | Just now
Discover how memory bottlenecks shape the future of AI on mobile devices, and what it takes to overcome them.
The growing integration of AI into everyday devices, from smartphones to edge systems, places increasing pressure on memory subsystems to handle demanding workloads efficiently. DRAM performance is critical for these applications, as memory bandwidth often becomes the limiting factor.
While workloads with regular and predictable access patterns, such as traditional LLM inference, can achieve near-optimal memory utilization under ideal conditions, real-world execution introduces two major challenges that significantly degrade memory efficiency. First, resource contention arises when memory bandwidth is shared across multiple actors, including hardware components (CPUs and AI accelerators) as well as concurrent software processes and background tasks, leading to unpredictable latency and reduced bandwidth. Second, modern AI workloads such as diffusion models, multi-agent systems, and retrieval-augmented generation (RAG) exhibit irregular memory access patterns that reduce row-buffer locality and prefetch effectiveness. These behaviors not only lower effective bandwidth but also amplify contention when combined with other traffic.
Understanding the combined impact of these challenges is essential for designing next-generation platforms that deliver consistent AI performance under realistic conditions. Insights from this study will guide improvements in memory hierarchies, scheduling policies, and system-level optimizations, enabling more responsive and power-efficient AI applications on resource-constrained devices.
As part of this internship, you will:
Ideal candidate profile:
Master's degree: Master of Science, Master of Engineering Science, Master of Engineering Technology
Required educational background: Computer Science, Electrotechnics/Electrical Engineering
Duration: 12 months
For more information or application, please contact the supervising scientists Tommaso Marinelli (tommaso.marinelli@imec.be) and Konstantinos Tovletoglou (konstantinos.tovletoglou@imec.be).