/Design flow and PDK engineer

Design flow and PDK engineer

Research & development - Leuven | Just now

Join us in exploring and enabling the design flow for our advanced packaging technologies.

Design Flow and PDK R&D Engineer

What you will do

At the forefront of imec’s advanced packaging innovation, the Connectivity Pathfinding (COP) department empowers the next generation of heterogeneous integration. By bridging process technology with design enablement, we ensure seamless, scalable, and production-ready solutions that accelerate multi-die system development. Our work is essential to unlocking the full potential of chiplet-based architectures in AI, HPC, and beyond.

You will be joining the Demonstrator Architect (DEAR) unit within COP as a skilled and motivated PDK and Design Flow Engineer to support the development and optimization of design enablement solutions for cutting-edge packaging technologies, including 2.5D and 3D IC integration for the NanoIC pilot line, as part of the European Chip Act.

In this role, you will be responsible for exploring and enabling the design flow for our advanced packaging technologies under the EU chip acts. You will be responsible for developing the flow, testing it, and applying it to real-world use cases. Additionally, they will lead the PDK development and maintain the PDK at a high level of maturity. A close collaboration with process engineers, EDA tool vendors, and design teams is expected to ensure that our packaging PDKs and flows are robust, scalable, and production-ready.

  • Lead the development and maintenance of PDKs for advanced packaging nodes, including interposer-based 2.5D and stacked-die 3D designs.
  • Support and enhance custom and automated design flows (e.g., layout, LVS/DRC, parasitic extraction) for multi-die integration.
  • Collaborate with EDA vendors to integrate and validate tools for heterogeneous packaging flows.
  • Provide documentation, training, and hands-on support to internal users of the PDK and design flows.
  • Contribute to design enablement activities across chiplets, interposers, and TSV-based stack technologies.
  • Debug and resolve issues across the design flow, from schematic capture to layout and verification.
  • Implement design rules, create technology files, and develop supporting scripts (e.g., Python, TCL, SKILL).
  • Validate and benchmark flows using test vehicles and early-stage customer designs.[A(1] [FF2] 

What we do for you

We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.

We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth. 

We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits. 

Who you are

  • Master’s or PhD degree in electrical engineering, Computer Engineering, or a related field.
  • 2-5 years of experience working with PDKs and IC design flows, preferably in the context of advanced packaging.
  • Hands-on knowledge of EDA tools (Cadence, Synopsys, Mentor, or similar) in the areas of layout, verification (DRC, LVS), and extraction.
  • Experience with 2.5D/3D design flows, including handling of interposers, RDLs, and die stacking.
  • Understanding of PDK components: technology files, layer definitions, parameterized cells (PCells), rule decks, etc.
  • Strong scripting skills (e.g., Python, TCL, SKILL) to support flow automation and customization.
  • Familiarity with packaging-related constraints such as thermal, mechanical, and signal integrity considerations is a plus.
  • Good problem-solving and communication skills, with the ability to work collaboratively in cross-functional teams.
  • You demonstrate excellent interpersonal and communication skills, with the ability to effectively collaborate across multidisciplinary teams.
  • You possess a critical mindset and are eager to explore new challenges in the future, evolving alongside the changing R&D demands.
  • You are an open and constructive team player. 

We seek a candidate who thrives in a dynamic work environment, showcasing an adaptability to diverse projects or research topics. You’ll be a key team player, ready to support colleagues and tackle impactful projects within the timelines of our trusted global partners.

IMEC and its affiliates will not accept unsolicited resumes from any source other than directly from a candidate. IMEC will consider unsolicited referrals and/or resumes submitted by vendors such as search firms, staffing agencies, professional recruiters, fee-based referral services and recruiting agencies (hereafter “Agency”) to have been referred by the Agency free of charge. IMEC will not pay a fee to any Agency that does not have a prior written agreement with IMEC, validated by its HR department, in place regarding a specific job opening and allowing to submit resumes.

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