§Problem statement, scientific
challenge
§Interfaces between (different)
superconductors are important for continuous, superconducting links between
different layers in a future cryogenic system. For conventional bonding
approaches, IMCs can interrupt superconductivity, while dissimilar superconductors
can result in complex quasiparticle dynamics. This PhD will study, in depth,
the interface between superconductors using a variety of techniques, focusing
on both mechanical and electrical behavior.
§Electrical and mechanical
properties of the interfaces, including the study of IMCs at cryogenic, RT and above melting point
of solder material
§Research objectives, goals
§Mechanical and Electrical
characterization of different superconducting interfaces, including (but not
limited to) bonded approaches based on Cu/In
IMC at cryogenic temperature and molten phase
§Propose stable metallurgical
systems and approaches for different applications
§Methodology/workplan
§Electrical test, mechanical test
(Charpy, die shear test) XRD, EDX, SEM of interfaces and IMCs after cycles of
high and low temperatures using blanket films and functional interconnects
§In-situ monitoring interface
resistance change by time at different temperatures followed by extraction and
modeling of the interface formation