Mechanical stability of advanced nano-interconnects using pico-indentation

The PhD offers an exciting opportunity to explore and enhance the mechanical reliability of advanced nano-interconnects. These interconnects handle power and signal distribution in electronic circuits between transistors and to the outside world. In next-generation IC’s, the goal is to use interconnects that are below 10 nm in width, separated by only a few nm’s of air. Although such advanced nano-interconnects are great from an electrical point-of-view, their mechanical durability is heavily challenged. During processing and during/after packaging, interconnects need to withstand immense stress in the order of a few 100 MPa and higher.

During this PhD, you will study the mechanical stability of next-gen nano-interconnects experimentally through a state-of-the-art in-situ nanomechanical testing tool, such as a pico-indenter integrated into an advanced electron microscope. This allows to locally apply high mechanical loads, while visualizing real-time collapse/failure of such nanostructures at the nm-scale. Combined with advanced simulations, you will unravel the deformation and failure mechanisms that occur at this fascinating nano-scale, which will help greatly with improving the next generation of IC’s.

This PhD position offers a unique opportunity to perform cutting edge research with state-of-the-art infrastructure at one of the most innovative research organizations in Belgium. The supervisors of this PhD are world-recognized experts from both KU Leuven and imec in the field of nano-indentation and related thermo-mechanical modeling techniques.