Development of Thermal Characterization Methodologies for Large Multi-Chiplet Packages

As the semiconductor industry pushes the boundaries of performance and integration, large multi-chiplet packaging has emerged as a transformative solution for building powerful, scalable systems. These packages—especially in automotive and high-performance computing applications—are expected to grow up to 9× in reticle size, enabling unprecedented functionality and parallelism. However, this scaling introduces complex thermal and mechanical challenges that threaten device reliability and performance.

In large multi-chiplet systems, package warpage and internal stresses can severely degrade heat transfer interfaces, leading to elevated junction temperatures, thermal throttling, and long-term reliability concerns. Despite the urgency, current methodologies fall short in predicting these risks before assembly, particularly under conditions of high warpage and mechanical deformation.

This PhD project aims to bridge that gap by developing and validating multiphysics simulation methodologies—coupling thermal and mechanical models—to accurately predict the thermal behavior of large chiplet packages. It will also include experimental validation using advanced test vehicles and statistical analysis to understand how warpage variability affects thermal performance across different designs.

By tackling these challenges, the research will contribute to the next generation of robust, thermally optimized chiplet architectures, supporting the growing demands of automotive electronics, AI systems, and edge computing. This is an exciting opportunity for students passionate about thermal engineering, microelectronics, and simulation-driven design to make a tangible impact on future technologies. The research will combine:

1. Multiphysics Simulation Development
• Create coupled thermal-mechanical modelling workflows that incorporate warpage effects into thermal performance predictions.
• Simulate realistic package geometries and material stacks to capture stress-induced thermal degradation.
2. Experimental Validation
• Use dedicated chiplet thermal and mechanical test vehicles to perform warpage, stress and thermal measurements.
• Correlate simulation results with empirical data to refine models and improve predictive accuracy.
3. Statistical Analysis
• Analyse the variability of warpage across multiple samples and its influence on thermal metrics.
• Develop guidelines for acceptable warpage thresholds in large chiplet designs.

This research will enable the scalable integration of large chiplet packages by providing robust methodologies to predict and mitigate thermal risks early in the design cycle. The outcomes will directly support automotive electronics, where thermal reliability is paramount.