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Electrical and mechanical properties of IMC layers for fine pitch microbumps in 3D technology
PhD - Leuven | Just now
understanding and predicting the IMC growth in solid and liquid phases is key for the performance of 3D stacked electronics chips. PhD student will experimentally measure this growth and then will use simulation tools to predict the lifetime of the product.
§Problem statement, scientific
challenge
§IMC growth mechanisms in liquid or
solid phase through reaction and diffusion for 3D applications is a rich
and challenging field linking materials science and technology
§Experiments and phase field
simulation are often used for thorough description and mechanisms study
§Electrical and mechanical
properties of IMCs at RT and above melting point of solder material
§Research objectives, goals
§Mechanical and Electrical
characterization of for example Cu/Sn, Ni/Sn and Ni/Cu/Sn IMCs
§Defining a model to predict the IMC
growth at different temperatures for microbumps pitches ranging from 100um down
to 5um
§Propose a stable metallurgical
system for different applications
§Methodology/workplan
§In-situ electrical resistance test,
mechanical test, SEM, XRD, EDX and EBSD of IMCs
§Phase filed simulation of IMCs for
bump scaling
Required background: physics, material science, electrical engineering
Type of work: 50% experimental 40% simulation 10% literature
Supervisor: Kristof Croes
Co-supervisor: Jaber Derakhshandeh
Daily advisor: Jaber Derakhshandeh
The reference code for this position is 2026-134. Mention this reference code on your application form.