PhD Topic Overview for the Upcoming Call (June 22nd – July 8th, 2026)
Research & development - Leuven | Just now
This page provides an overview of the PhD topics that will be open for application in the upcoming PhD call.
Please note that this is not an application page. Applications are not yet open and it is currently not possible to apply for any of the listed topics.
Disclaimer: clicking the “Apply” button at this stage will result in an error message. This is normal, as the application call is not open yet.
At this stage, only the PhD topic number and title are shown. Full topic descriptions, along with the possibility to submit an application, will become available when the call opens on June 22nd. The application window will run from June 22nd to July 8th, 2026.
The PhD topics are grouped into three research domains: Compute technologies & systems, Industry & Consumer, Health.
Compute technologies & systems
2026-017 Thermogalvanic chip cooling
2026-022 Reliability of semiconducting oxides: the last roadblock for memory applications
2026-031 Wireless communications enhanced by distributed movable antennas
2026-041 Improving the success rate of Atom Probe Analysis
2026-043 Acoustically-Enhanced Heat Transfer for Electronics Cooling
2026-048 Alleviating Thermal Challenges In Angstrom Nodes: Paving The Way For 3D Integrated Circuits (3D-ICs) of The Future
2026-051 Backside technology circuit boosters for SRAM scaling
2026-058 Explainable Neurosymbolic Algorithms for Process Optimization in Semiconductor Manufacturing
2026-070 Mechanical stability of advanced nano-interconnects using pico-indentation
2026-073 Model-Based Reinforcement Learning for Scheduling Optimization in Semiconductor manufacturing (FAB) Environment
2026-088 Design automation for load modulated GaN power amplifiers
2026-096 Use Nothing, Leak Nothing: Energy-Efficient AI That Keeps Its Secrets
2026-102 Large-Scale GPU Clusters based on Silicon Photonic Network
2026-103 Co-Design of AI-Accelerated HPC Architectures for Scientific Computing
2026-113 Data Authenticity at the Edge in the Age of Generative AI
2026-131 Mathematical Statistical methods for ML algorithms for EUVL
2026-133 Exploration of scale-up and scale-out VPUs in open-source SoCs
2026-157 Low-power and low-cost silicon photonic interconnects
2026-161 Multiscale Thermal Investigations of High Thermal Conductivity Heat Spreaders for Advanced Microelectronic Packages
2026-180 PhD position in microfluidics; Study of capillary underfill process for packaging optical interconnects into HPC & AI compute systems
2026-192 PhD position in electronics cooling; Engineered nanostructured surfaces for improved immersion cooling solutions with applications to HPC/AI data centers
2026-198 Ga2O3-based RF power devices with thermal management
2026-199 Molecular layer deposition of organic–inorganic hybrid films as novel patterning materials
2026-202 Computer Vision for Defect Inspection and Metrology: Solving Semiconductor Manufacturing Challenges towards Advanced Process Control using Machine Learning
2026-204 Interface Engineering and Microstructure Control in Thermocompression Bonding for 3D ICs
2026-208 Sustainable Design-Technology Co-Optimization for Advanced Technologies
2026-213 Transceiver architectures for cellular communications in the FR3 band
2026-217 Design-Technology Co-Optimization for Devices in the CMOS2.0 Era
2026-219 Advancing Ultrasonic Inspection for Voids in Heterogeneously Integrated Semiconductor Devices
2026-222 Inline metrology with Atomic Force Microscopy: from homogeneous smooth surfaces to high-aspect-ratio multi-material devices
2026-224 Chemistry and Confinement‑Driven Interactions of Sub‑10 nm Particles at Interfaces
Industry & Consumer
2026-042 Shape Morphing Actuation in Thin Film Kirigami-Inspired Micro-robotics
2026-057 Photonic integrated solid-state lasers for scalable quantum systems
2026-104 Advancing Diamond-Based Quantum Technologies
2026-121 Near/in-sensor computing for edge AI
2026-128 Gain modulation in thin film lasers
Health
2026-037 Exploring 3D-μEIT platform for dynamic, label-free, and non-invasive 3D tracking of organoid development and disease progression
2026-100 CMOS-integrated 2D-fluidics for high-throughput single-biomolecule transport and sensing
2026-147 AI-assisted High-Framerate Speckle Image Analysis
More information
If you have any questions, you may find the answer on our FAQ page, where we have collected the most common questions.
If not, you are always welcome to reach out to us via phd@imec.be
We look forward to receiving your application once the call opens on June 22nd, 2026!