Study of advances 3D silicon photonics coupling system

The optical I/O and interconnection technology aim efficiently to transmit signals within the integrated circuit (IC) nodes. The advances in 3D silicon photonics involve vertical-stacked assembly both for electrical and optical parts toward the wafer-level stage, different structures are being explored intensively in the literature. The 3D silicon photonics can transmit optical signals vertically and target arbitrary directions to enable better coupling flexibility and packaging structures. Eventually, these optical signals will be delivered to a fiber array connector for even longer distance transmission. The coupling technique impacts significantly to realize low loss and robust 3D silicon photonics packaging. In this PhD program, you will explore and study the solutions of 3D silicon photonics coupling systems. This will include optimization of surface coupling devices such as fiber grating coupler, integrated optical mirror, and many more with the boundary conditions from the packaging house.  Combined with flat optics design such as dielectric meta-lens, you will construct a 3D coupling optical system in silicon photonics platform to demonstrate a novel coupling strategy.