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Sony and imec unveil high-density backside connectivity module enabling next-generation 3D chip integration

The new integration approach implements sub-100nm self-aligned through-Si via connections, enabling low-resistance and low-leakage front-to-back connections with good overlay performance https://www.imec-int.com/en/press/sony-and-imec-unveil-high-density-

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ASML, TSMC and imec bring industry-ready 2D-material transistors closer with breakthrough 300mm integration

Novel 300mm integration approach for 2D-material based devices enables scaled n and pFETs with 50nm contacted poly pitch

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Imec unlocks system-level III-V chiplet integration on Si-CMOS by advancing its 300mm RF silicon interposer platform with high-density MIMCAPs, passive modeling, and laser-assisted bonding

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Imec unlocks fourfold UWB range extension

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Imec and EV Group demonstrate W2W hybrid bonding with 200nm interconnect pitch and record-high overlay accuracy

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Imec is the world's leading independent nanoelectronics R&D hub. The combination of our talent, infrastructure, and partner network enables breakthroughs towards microchips that are smaller, faster, more affordable, and more sustainable. We combine that nanotech expertise with data and AI to create and support applications for a smarter, better future.

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Press release

16 June 2026

Sony and imec unveil high-density backside connectivity module enabling next-generation 3D chip integration

The new integration approach implements sub-100nm self-aligned through-Si via connections, enabling low-resistance and low-leakage front-to-back connections with good overlay performance

Press release

15 June 2026