Non-terrestrial network (NTN) semiconductor technologies
Satellite systems need low-power, compact, robust, and high-performance electronics and photonics for 5G and 6G NTN. Imec offers a broad technology portfolio and support from research to manufacturing.
The need for universal wireless connectivity is pushing the telecommunications industry to expand its infrastructure beyond our atmosphere. Non-terrestrial networks use satellites to extend mobile network coverage and enable connectivity between terrestrial users and networking infrastructure, including direct-to-cell (D2C) and direct-to-device (D2D) services.
Besides the massive infrastructural effort of putting large satellite constellations in orbit, NTN presents a number of challenges when it comes to payload electronics:
- Components must be extremely low-power and compact.
- Even in low Earth orbit (LEO) or medium Earth orbit (MEO), radiation-tolerant or radiation-hardened electronics may be needed.
- As the industry prepares for 6G NTN, satellite communications technology must support high operating frequencies and rapid data processing.
- High-speed wireless links requiring directed RF or optical beams, resulting in challenges on beam-forming and -steering.
Imec has experience in space electronics and radiation-hardened IC design, with custom ASICs and sensors already operating in space. Our expertise spans RF, photonics, and massive MIMO and advanced beamforming technologies, which are expected to play an important role in future NTN systems.
Combining advanced research, system-level validation, and a route to custom-chip manufacturing within one organization, we're well-positioned to support your NTN electronics development.
Are you a start-up active in this space? Make sure to check out how we support semiconductor-driven ventures.
System and circuit RF IP for demanding NTN applications
Imec's advanced system and circuit IP enables you to tackle requirements that cannot be met by off-the-shelf semiconductor IP. Relevant technologies include:
- Best-in-class data converter and transceiver IP.
- Beamforming and signal-processing systems and algorithms.
Imec not only develops these technologies but can also demonstrate them at system level and help you transition them into manufacturable products through IC-Link.
Imec's 42GS/s 7b massively time-interleaved slope-ADC prototype chip.
Advanced RF materials and semiconductor processes
5G and 6G NTN require moving to higher frequencies and output-power levels, where conventional silicon CMOS or BiCMOS may not meet all efficiency and performance requirements, particularly in power amplifiers.
Imec's advanced RF research program investigates the material and process innovations needed to integrate III-V semiconductors with silicon CMOS in a cost-effective and scalable way.
We explore:
- RF GaN-on-silicon (GaN-on-Si) targeting the FR3 frequency range (6-20 GHz) in the medium term.
- RF InP-on-silicon (InP-on-Si) targeting even higher frequencies (>100 GHz) in the longer term.
- RF interposer technology to enable the cost-effective integration of multiple semiconductor technologies (e.g., RF GaN or other III-V dies together with CMOS EIC dies) in a single package, with low loss even at high frequencies.
Zoom-in of a 300 mm silicon wafer showing dies with InP NRE HBT structures.
Optical communication and data processing
As satellite systems process and exchange growing volumes of data, optical technologies are becoming increasingly important.
Imec's expertise in integrated photonics, nano-optics and optical beamforming techniques support the development of components for optical communication systems such as free-space optical transceivers, e.g. for optical inter-satellite links.
Optical connections are also playing a crucial role in high-performance compute and AI systems, for instance emerging concepts such as space-based computing and data-processing infrastructures. Imec's optical interconnect research program develops the key technology building blocks for achieving these next-generation optical transceivers.
A route to manufacturing is available through IC-Link's integrated photonics manufacturing platforms.
Reusable ASIC platforms for NTN satellite payloads
Modern NTN satellites rely on large beamforming antenna arrays to establish reliable communication links over long distances. These arrays often consist of hundreds to thousands of antenna elements. They therefore require highly efficient ASICs to manage signal transmission and reception.
IC-Link provides reusable ASIC platforms that you can adapt to your specific requirements, reducing development time and accelerating product introduction. These platforms combine RF digitization, digital beamforming, calibration support, and scalable inter-chip connectivity in one agile development flow.
Based on an understanding of your mission and payload architecture, IC-Link helps you to define the optimal ASIC partitioning and specification, and delivers custom ASICs from engineering samples to volume production.
Work with us
Team up with imec to develop advanced semiconductor technologies for NTN satellite communications. Depending on your needs, you can:
- Join one of our precompetitive research programs addressing next-generation wireless technologies or optical interconnects for high-performance computing and data processing in space.
- Enter into a bilateral R&D collaboration to accelerate your innovation and develop application-specific IP.
- Work with IC-Link on the design and manufacturing of advanced ASICs or photonic integrated circuits.
Click the contact button to contact our team and discuss your NTN technology requirements.
