imec article Heterogeneous integration
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Heterogeneous integration technologies to enable the next generation of wireless 6G

InP shows promise to power 6G technology. Heterogeneous integration is key to its advancement, co-integrating all components into a cohesive system.

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The future 6G asks for materials and devices that can operate at >100GHz.

Indium Phosphide (InP) can deliver the required speed, efficiency, and output power.

For future use of InP technology, imec explores nano-ridge engineering to grow InP on silicon.

To co-integrate all components into a communication circuit, imec is looking into PCBs, 2.5D, and 3D methods