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The promise of hybrid graphene/metal structures for advanced interconnects


Hybrid structures of graphene and metal are worthy candidates for extending the back-end-of-line technology roadmap beyond 1nm. 

This article takes a closer look at two of these hybrid schemes: a graphene-capped metal interconnect and a stack of alternating graphene/metal layers.

The authors discuss the potential of using these hybrid structures as advanced interconnects, they highlight the crucial role of (engineering) the interface between the two conducting materials and list the remaining integration challenges.

At the 2021 IEEE International Interconnect Technology Conference, imec presents other options for scaling the back-end-of-line.