imec article Alternative metals
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Can binary or ternary compounds beat Cu in future interconnect applications?

A unique methodology to explore alternative interconnect metals for the Ångström era.


About five years ago, imec researchers started to explore binary and ternary compounds for replacing Cu as future interconnect metallization schemes: the start of a new global research field.

They set up a unique methodology that provides guidance for ranking the numerous possible candidates.

In this article, the authors unravel the proposed methodology, highlight the first results, and look into future work.