Imec.IC-link adds value across the entire ASIC value chain
- Access to leading edge foundries for any volume and supported by a world class support group.
- Build on the knowledge of imec research.
- Access our expertise in low-power design.
- Gain access to our technical support teams for technologies ranging from 0.5µm to 16nm feature sizes.
- Work flexibly with either Full Turn-Key (FTK) or Customer-Owned Tooling (COT) design flows.
- Transition from small-scale Multi-Project Wafer (MPW) prototyping runs to volume production using our ASIC supply-chain management services.
our partners
Imec.IC-link Design and IP Partnership Programs
Our partnership programs are designed to pool the talents and resources of the world-class design and IP companies located bother locally and internationally. This program allows us to select and coordinate the wide range of capabilities that are needed to deliver full turn-key design projects to our customers.
"I have been working with Imec throughout my 25 year career in the semiconductor industry. They were a natural partner when we founded Lime Microsystems back in 2005. It's a one stop shop ranging from advice on IC design all the way to establishing a full turn key route to manufacture."
Lime Micro's CEO, Dr. Ebrahim Bushehri
"AnSem, the leading analog, mixed-signal and RF turnkey ASIC design and supply company has chosen TSMC as its main technology partner for the past two decades.
Thanks to IC-Link as the technology expert and business center of TSMC in Europe, AnSem can offer its customers access to a leading silicon manufacturer for any business volume with a wide choice of technologies."
Stefan Gogaert, CEO AnSem
Discover how our expertise leads to gamechanging stories
At imec bright people build a bright future.
You could be one of these builders. Whether you are an engineer or an operator, a consultant or PhD student, we need a versatile group of people to help us create positive change.
Join the forward thinkersJob opportunities
Characterization and Modeling of Ferro and AntiFerro Device
Explore the potential of Ferro and Antiferro devices and materials in post-Moore's systems and circuits
Alternative solder materials for electronic devices working at low/cryogenic temperatures
Which solder will work for the packaging of quantum computers? The goal of this PhD thesis is to select and study the metals that can be used as solder and UBM for packaging and 3D integration of devices for low temperature applications particularly quantum computers.
New Frontiers in Wired, Optical and Wireless Communications
You will be architecting the wired, optical and wireless networks of tomorrow!
Circuit and System Level Exploration of Sequential 3D Technology
Identifying the possibility of imec sequential 3D technology in post-Moore era.
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