imec article Semi-damascene
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Research update

Imec demonstrates semi-damascene interconnects with fully self-aligned vias at 18nm metal pitch

Two-metal-level semi-damascene module yields excellent line/via resistance and reliability – a world first


Semi-damascene integration is an attractive, cost-effective approach to extend interconnect process flows below 20nm metal pitch.

This article presents the first experimental demonstration of a functional two-metal-level semi-damascene module at 18nm metal pitch, with fully self-aligned via.

The results were presented at VLSI 2022.