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High-NA EUV lithography: the next major step forward


In the course of 2025, we expect to see the introduction of the first high-NA extreme ultraviolet  lithography (EUVL) equipment in high-volume manufacturing environments. 

These next-generation lithography systems will be key to advance Moore’s Law towards the logic 2nm technology generation and beyond.

In this article, imec scientists and engineers involved in preparing this major engineering project (in partnership with ASML) talk about challenges and opportunities. They highlight recent insights. And they discuss the progress made in developing the patterning processes, metrology and photomasks needed for enabling the high-NA EUV lithography infrastructure.