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The SuperVia: a promising scaling booster for the (sub-)3nm technology node

The imec interconnect team is making progress towards realizing a SuperVia – a high-aspect-ratio via that connects an Mx metal layer with an Mx+2 metal layer. Although several technological challenges lie ahead, a first proof of concept demonstrates the potential of this ‘oversized’ via as an enabler for cell height scaling – a complementary approach to dimensional scaling for future technology nodes. 

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