Design and foundry services
As a catalyst of semiconductor innovation, imec strives to lower the barrier to chip manufacturing. Companies, including start-ups, can use imec as a single point of entry to design support, chip fabrication, packaging, and qualification – in a wide range of standard and more exploratory technologies.
Custom design and specialty fabrication services at imec
Does your device require access to special process steps? You can work out the process flow on imec’s established process modules up to prototyping and small series. For high-volume manufacturing, the process developed at imec can be transferred to a foundry.
Imec's process modules are available for CMOS post-processing, cross-module build, single step processing or as stand-alone platforms, sometimes – such as silicon photonics – with a PDK.
Types of available substrates include silicon, SOI, CMOS post-processing and glass.
Imec constantly develops different process modules and platforms. Please reach out if you have any specific requests.
| Process category | Key process modules | Substrate size and platform |
|---|---|---|
| Si photonics | Waveguide c-Si/actives & SiN | 200mm iSiPP200 130nm platform |
| Ge photodectors | 200mm iSiPP200 130nm platform | |
| SiN photonics | LPCVD waveguides | 200mm LPCVD SiN 130nm |
| Actives (lasers/modulators) | 200mm LPCVD SiN 130nm | |
| PECVD waveguides | 300mm PECVD 65nm | |
| Pixels | UV pixel | 200mm CMOS 130nm |
| Electron pixel | 200mm CMOS 130nm | |
| SWIR QD/Ge/InGaAS | ||
| Nano-optics | NIL masters | 200- & 300mm 130nm - 65nm |
| On-pixel multispectral | 200- & 300mm | |
| On-pixel waveguide | 300mm | |
| Meta-optics | 200mm(130nm)/ 300mm (65nm)/ 200&300mm NIL <50nm | |
| M(O)EMS | Nanopores (<20nm) | 300mm - EUV |
| Cavity bonding | 200mm - nanogap | |
| Silicon membranes | 200- & 300mm | |
| Piezo (Sc) AlN | 200mm PMUT | |
| Waveguides in dielectric membranes | 200mm photo-acoustic | |
| 3D integration | Through-silicon vias | 200- & 300mm |
| Layer transfer | 200mm | |
| Wafer bonding | 200- & 300mm | |
| Hybrid bonding | 200- & 300mm < 5µm pitch | |
| Heterogeneous integration | 200- & 300mm | |
| Novel materials | Platinum electrodes | 200- & 300mm |
| Electro-optics (BTO/LNO) | 200mm | |
| Magnetic/resistive alloys | 300mm | |
| GaN | Epitaxy | 200mm GaN-IC |
| Mesa | 200mm GaN-IC |
IC-Link: gateway to ASIC manufacturing in major foundries
IC-Link, imec’s ASIC division, guides you through the process of designing and manufacturing an application-specific circuit (ASIC).
IC-Link is a TSMC value chain aggregator (VCA) and has agreements with other major foundries, ensuring easy access to IC production in any volume and in several standard to advanced technologies.
On top of manufacturing, several additional services are available: design and IP support, assembly, advanced packaging, testing, qualification and optimization.
Supporting expertise for dedicated applications
To tailor imec’s technology toolbox to your application, imec’s experts bring in a wealth of expert knowledge to support your prototyping project. This includes:
- imaging, sensing and actuation
- optical beamforming
- silicon and silicon nitride photonics design, including customized laser design for integration with silicon photonics
- nano-imprint lithography
Want access to our design and foundry services? Click the button below to get in touch.
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