Silicon photonic ICs for prototyping
Imec offers an integrated silicon photonics platform targeted to the telecom, datacom and medical diagnostics industries: our Silicon Photonics Platform (iSiPP). The iSiPP platform co-integrates a wide variety of passive and active components, enabling competitive photonic integrated circuits for short reach optical interconnects.
Three flavors of iSiPP
Imec's iSiPP platform is SOI-based and comes in three distinct flavors:
- iSiPP200: 200mm (8”) full platform (see table below)
- iSiPP50G: 200mm (8”) simplified platform/flow (see table below)
- iSiPP300: options with TSV (through silicon via), microbumps and embedded microbumps are available in a 300mm (12”) platform
Prototyping services
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iSiPP50G |
iSiPP200 |
||
|
Access model |
MPW |
Shared run |
Dedicated run |
|
Functionality |
Basic (23 modules) |
Full (30 modules) |
Full (30 modules) |
|
Silicon delivery |
Dies from up to 3 wafers |
Dies from up to 3 wafers |
Full wafers (minimum 15) |
|
Run timing |
Fixed |
Semi-flexible |
Flexible, upon request |
|
Minimum area |
5mm x 5mm |
Quarter reticle (10mm x 9mm) |
Full reticle (21.5mm x 18.5mm) |
|
Metrology/test |
Standard test |
Standard test |
Standard test |
|
Customization |
Limited (upon availability) |
Options available (Semi Flexible) |
Options available (Fully Flexible) |
|
Cost sharing |
Mask and processing |
Mask and some processing |
None |
Key technology parameters
- Starting substrate: Silicon-on-insulator with 220nm Si / 2000nm BOX
- 3-level Si & 1-level poly-Si patterning with 193nm lithography
- 6-level silicon doping & 2-level Ge doping
- Ge-on-Si RPCVD epitaxy
- 2-level Cu interconnects + Al bondpad
- Deep-Si etch for edge coupling
Available devices
- Traveling–wave Mach-Zehnder p-n modulator
- Ge(Si) electro-absorption modulator
- Micro-ring p-n modulator
- Waveguide-based Ge-on-Si detectors
- Fiber coupling:
- Vertical “raised” grating
- C-band edge coupler
- Passive waveguide-based devices such as filters
- Integrated heaters
