Silicon photonic ICs for prototyping

Three flavors of iSiPP

Imec's iSiPP platform is SOI-based and comes in three distinct flavors:

iSiPP200: 200mm (8”) full platform (see table below)
iSiPP50G: 200mm (8”) simplified platform/flow (see table below)
iSiPP300: 300mm (12”) full platform

Prototyping services

	iSiPP50G	iSiPP200
Access model	MPW	Shared run	Dedicated run
Functionality	Basic (23 modules)	Full (30 modules)	Full (30 modules)
Silicon delivery	Dies from up to 3 wafers (15 dies minimum)	Dies from up to 3 wafers (20 dies minimum)	Full wafers (minimum 15)
Run timing	Fixed (2-3 runs per year)	Semi-flexible (max 4 customers on 1 run)	Flexible, upon request
Minimum area	5mm x 5mm	Quarter reticle (10mm x 9mm)	Full reticle (21.5mm x 18.5mm)
Metrology/test	Standard test	Standard test + dedicated test [optional]	Standard test + dedicated test [optional]
Customization	Limited (upon availability)	Options available (Semi Flexible)	Options available (Fully Flexible)
Cost sharing	Mask and processing	Mask and some processing	None

Key technology parameters

Starting substrate: Silicon-on-insulator with 220nm Si / 2000nm BOX
3-level Si & 1-level poly-Si patterning with 193nm lithography
6-level silicon doping & 2-level Ge doping
Ge-on-Si RPCVD epitaxy
2-level Cu interconnects + Al bondpad
Deep-Si etch for edge coupling

Available devices

Traveling–wave Mach-Zehnder p-n modulator
Ge(Si) electro-absorption modulator
Micro-ring p-n modulator
Waveguide-based Ge-on-Si detectors
Fiber coupling:
- Vertical “raised” grating
- C-band edge coupler
Passive waveguide-based devices such as filters
Integrated heaters

How can we help you?

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