Ionically driven chip-cooling

As high-performance computing continues to push the boundaries of speed and efficiency, the thermal management of microchips has become a critical bottleneck. With transistor scaling driving ever-increasing power densities, traditional cooling methods—such as heat exchangers and thermal interface materials (TIMs)—are reaching their limits. These conventional systems impose fixed thermal resistances that hinder further improvements, even when more advanced cooling technologies are introduced.

This PhD project offers the opportunity to explore a radically new approach to chip cooling: a miniaturized (solid-state) electrochemically driven cooling unit. At the heart of this concept lies an electrochemical cooling cell, designed to dissipate heat through endothermic redox reactions in the electrode material, which absorb heat directly from the chip. This process enables active and localized heat removal, potentially surpassing the limitations of passive cooling systems.

However, realizing this vision comes with challenges. Joule heating from electrical and thermal conduction introduces parasitic losses, and deviations from theoretical cooling efficiency arise due to activation energies and internal resistances. Your research will focus on tackling these hurdles. Furthermore, to enable seamless integration of this cell into existing semiconductor manufacturing workflows, it is essential to utilize CMOS-compatible materials.

Therefore, the core activities of this Ph.D. consist of: (1) selection and characterization of materials fit for electrochemical cooling, (2) design and fabrication of a miniaturized electrochemical cell with minimal internal and charge transfer resistance, and (3) characterization and modelling of the thermal and electrochemical behaviour of the system under realistic operating conditions.

You will join a world-leading research hub for nanoelectronics and digital technologies. Here, you will have access to state-of-the-art facilities for microfabrication, materials characterization, and electrochemical testing, and collaborate with experts in energy systems, chip design, and thermal management.

This project is ideal for candidates with a background in physics, chemistry, electrochemistry, materials science, thermal engineering, or microfabrication, and a passion for solving real-world challenges in advanced computing.