As logic and memory nodes scale, the performance of advanced interconnects is negatively impacted by increasing interconnect resistance. Furthermore, voids that occur in heavily scaled vias severely impact yield. 

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Join imec’s industrial affiliation program on advanced interconnects to explore together with industry leaders, the options to increase bandwidth density and improve power performance for reliable high speed distribution of signals within scaled logic and memory devices.

Our collaborate in a bilateral way with imec to explore specific topics or develop dedicated solutions.

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